A cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a source of fluid. The manifold includes at least one outlet. The at least one cleaning module further includes an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles and a pressure sensor coupled to the automatic valve. The pressure sensor is configured to measure pressure of fluid flowing through the conduit. The automatic valve is configured to adjust the flow of fluid through the conduit based on the pressure measured by the pressure sensor.

Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

A printer includes a belt, a tray and a plurality of printing devices located over the belt. The tray is located on the belt and receives a printed circuit board (PCB). A sensor attached to the tray. The sensor is used to sense whether the PCB is located in the tray, when the PCB is located in the tray, the belt is driven by a driving device to transport the tray to be located below each of the plurality of printing devices. Each of the plurality of printing devices is used to print the PCB. The disclosure further offers a printing method for the PCB using the printer.

The present invention discloses a surface tension driven flexible electronics transfer printing method which uses a surfactant liquid membrane or a surfactant bubble as a transfer printing stamp, to realize the transfer printing of an electronic device with nanometer/micron/submillimeter thickness. A process of transfer printing is transparent and visible in a what you see is what you get manner to realize the accurate positioning of the electronic device. A local load technology is introduced, which is suitable for arbitrary complex curved substrate to realize diverse transfer printing. The electronic device can be transfer-printed to an application substrate with extremely-low interfacial adhesion, without the requirement for the strong and weak adhesion switching strategy of the traditional transfer printing. An unbearable electronic device membrane can be transfer-printed to an fragile receiving substrate with no loss or low loss, without the introduction of pre-pressure.

The present invention discloses a three-dimensional circuit board processing apparatus, including an input module, a vertical processing module, and an output module, which are arranged in sequence. The vertical processing module includes a conveying unit and a processing assembly. A vertical conveying port is arranged on each of two sides of the vertical processing module. The input module is connected to one end of the conveying unit, and the output module is connected to another end of the conveying unit. The input module and/or the output module are/is a flippable module. According to embodiments of the present invention, by arranging the flippable input module and/or output module, the circuit board may enter and exit the vertical processing module vertically, and may be uniformly processed through the vertical processing module, thereby enhancing the processing quality of the circuit board and improving the automation performance of three-dimensional processing.

The invention relates to a holding device for holding substrates such as printed circuit boards, metal sheets, foils or the like, comprising a suction surface, the suction surface having a plurality of suction nozzles and the suction nozzles being subjected to a negative pressure relative to the ambient pressure by means of a device providing negative pressure for providing a holding force for one or more substrates, wherein the device providing negative pressure provides negative pressure, such that the ratio of the cumulated drop in pressure of all suction nozzles to the cumulated drop in pressure of all suction nozzles and supply lines of the suction nozzles up to the device providing negative pressure is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, in particular greater than 35%, preferably greater than 40%.

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

A circuit device includes: a heat sink having an upper surface orthogonal to a first direction; a plurality of first partition plates attached to the upper surface and extending in a second direction orthogonal to the first direction; a plurality of second partition plates attached to the upper surface and extending in a third direction orthogonal to the first direction and the second direction; a circuit component; a substrate electrically connected to the circuit component; and a first heat transfer member. The circuit component is housed in a space surrounded by two adjacent first partition plates, two adjacent second partition plates, and the upper surface. The first heat transfer member is disposed between the first partition plate and the circuit component.

A printing apparatus for printing workpieces comprises a rotary table supporting first and second platens rotatable between a loading position located in-line between input and output lines. The transfer apparatus is operable to cyclically perform first and second movement operations, in which the rotary table rotates to move the first platen from a loading position to a printing position and vice versa. The platens may be rotatable relative to each other.