Systems and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes calibrating flow rate of a material through a coating system. A target flow rate for the material through a spray nozzle is received, a first operating pressure of the coating system based upon the target flow rate is calculated, and the material is ejected onto a least part of a surface with the material flowing through the spray nozzle at the first operating pressure of the coating system. Subsequent to a comparison between an operating flow rate and the target flow rate, the operating pressure is adjusted to a second operating pressure and at least part of the substrate is sprayed with the material flowing through the spray nozzle at the second operating pressure of the coating system.

Provided are a device and method for molding an FPC and a plastic part, which belongs to the field of FPC processing technology. The method for molding an FPC and a plastic part includes preprocessing a preform and connecting an FPC to the outer cylindrical surface of the preform; and forming a coating on the outer cylindrical surface of the preform by using the device for molding an FPC and a plastic part.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

Apparatus for transferring conductive patterns to a substrate (56), comprising a module (52) configured to transfer a pattern (63) of sinterable material (63a) to said substrate (56) and an optical module (12) to perform a sintering of the transferred pattern (63a). Said apparatus comprises one or more self-propelled pattern transferring units (52) comprising a module configured to move said self-propelled unit (14, 20) over said substrate (56) under the control of movement instructions (53b) associated to a motor (16, 21), said self-propelled unit (14, 20) comprising said module (52) configured to transfer a pattern (63a) of sinterable material (CI) to said substrate (56) obtaining a transferred pattern (63a) and comprising also said optical module (12) to perform a sintering of the transferred pattern (63a) on said substrate (56) obtaining a sintered pattern (63b, 63c).

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

The present invention relates to devices and methods for measuring a varnish jet for a varnishing process for electronic subassemblies. Said devices and methods allow the width and symmetry of the varnish jet to be determined without performing any relative movement between the varnish jet and the sensor.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.

Provided are a device and method for molding an FPC and a plastic part, which belongs to the field of FPC processing technology. The method for molding an FPC and a plastic part includes preprocessing a preform and connecting an FPC to the outer cylindrical surface of the preform; and forming a coating on the outer cylindrical surface of the preform by using the device for molding an FPC and a plastic part.