A unit can include a power supply interface; a processor board power interface operatively coupled to the power supply interface where the processor board power interface operatively couples to and supplies power to a processor board; a serial interface that operatively couples to the processor board; a microcontroller operatively coupled to the serial interface; memory operatively coupled to the microcontroller; a motor control interface operatively coupled to the microcontroller; an optically isolated digital input interface operatively coupled to the microcontroller; a digital output interface operatively coupled to the microcontroller; and instructions stored in the memory and executable by the microcontroller to instruct the unit to receive digital input via the optically isolated digital input interface from a machine and to output motor control signals via the motor control interface to at least one motor of the machine.

Systems and methods for venting a solvent are disclosed. The system includes a chamber, such as an oven having an interior volume defining a heating zone, where the interior volume receives at least one substrate coated with a coating material comprising a solvent. The system further includes a vent coupled to the oven and defining a passage between the interior volume and the environment external to the oven. The system also includes a solvent sensor measuring an amount of evaporated solvent present in the interior volume, and a fan removing at least a portion of the solvent from the interior volume. The system may also include a coating assembly including an applicator and a flow meter, wherein the applicator applies a portion of the coating material to the substrate, and the flow meter determines the amount of coating material applied to the substrate.

In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.

A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.

A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.

A system can include a processor; memory accessible by the processor; a display; and processor-executable instructions stored in the memory and executable by the processor to render a graphical user interface to the display, where the graphical user interface includes a graphic of a machine where the machine includes a conveyor; a UV zone that includes LED-based UV radiation sources; a heating zone; and a controller that controls power to at least one of the LED-based UV radiation sources and where the graphical user interface includes a functional graphic that responsive to actuation renders a menu to the display where the menu includes menu items for the UV zone.

A method of fabricating a packaging substrate includes following steps: providing a carrier board having two opposite surfaces, forming on each of the surfaces a plurality of first metal bumps; covering the carrier board and the first metal bumps with a first dielectric layer that has a plurality of first intaglios which exposes a top surface and side surface of the first metal bumps; forming a conductive seedlayer on the first dielectric layer and the first metal bumps; forming a metal layer on the conductive seedlayer; removing a portion of the metal layer and the conductive seedlayer that is higher than the top surface of the first dielectric layer, and forming a first circuit layer in the first intaglios; forming a built-up structure on the first circuit layer and the first dielectric layer, forming a pair of upper and lower entire packaging substrates.

A thermal overload device containing a polymer composite, which contains at least one polymer and a modified graphite oxide material, containing thermally exfoliated graphite oxide having a surface area of from about 300 m.sup.2/g to 2600 m.sup.2/g, and a method of making the same.

A display panel including: a substrate; a plurality of first connecting wires in a first portion of the substrate and connected to a first flexible printed circuit board; a plurality of second connecting wires in a second portion of the substrate and connected to a second flexible printed circuit board, the second portion being adjacent to the first portion; first and second test pads provided between the first and second portions of the substrate, the first test pad being connected to an endmost first connecting wire adjacent to the second portion, the second test pad being connected to an endmost second connecting wire adjacent to the first portion; and an electrical circuit in which the endmost first and second connecting wires are included in different power supply nodes.

A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.