A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

An arrangement, a method of manufacturing component carriers and a component carrier are provided. The arrangement includes a central carrier structure having a front side and a back side, a first layer stack having a first surface structure made of another material than the interior of the first layer stack and covered by a first release layer which is attached to the front side, and a second layer stack covered by a second release layer which is attached to the back side.

A method for producing a package substrate for mounting a semiconductor device includes:

forming a first substrate by forming a laminate in which a first metal layer that has a thickness of 1 μm to 70 μm and that is peelable from a core resin layer, a first insulating resin layer, and a second metal layer are arranged on both sides of the core resin layer having a thickness of 1 μm to 80 μm, and heating and pressurizing the laminate simultaneously;

forming a pattern on the second metal layer;

forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer on a surface of the second metal layer; and

peeling, from the core resin layer, a third substrate including the first metal and insulating resin layers, the second metal and insulating layers, and the third metal layer.

A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.

An electronic device module, includes a substrate including a grounding electrode disposed on a surface of the substrate, an insulating portion encapsulating a portion of the surface of the substrate, an electronic component disposed on the surface of the substrate, wherein the electronic component is at least partially encapsulated by the insulating portion, and a sealing portion, having electrical conductivity, disposed on the substrate and the insulating portion. The sealing portion is electrically connected to the grounding electrode.

A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.

Roll-to-roll processes for manufacturing touch sensors on a plastic base film are provided. The touch sensors can be deposited on the base film using various patterning techniques. One or more shorting bars can also be patterned onto the base film to couple together traces, such as drive lines, sense lines, conductive traces, and the like, of the touch sensor to prevent a potential difference from forming between traces due to static buildup during the manufacturing process. After the touch sensor is fully formed on the base film, the touch sensor can be removed from the base film using lithography or a physical cutting process. The removal process can separate the touch sensor from the one or more shorting bars, thereby uncoupling the traces of the touch sensor.

Through the use of a method of producing electronic components, a plurality of electronic components are obtained by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components. The method of producing electronic components includes: a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therewith, the first circuit board being provided with a filled via around a mounting region of the circuit components; a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with insulating resins; and a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components.

The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and/or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.

A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.