Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.

An economical, efficient, and effective formation of a high resolution pattern of conductive material on a variety of films by polymer casting. This allows, for example, quite small-scale patterns with sufficient resolution for such things as effective microelectronics without complex systems or steps and with substantial control over the characteristics of the film. A final end product that includes that high resolution functional pattern on any of a variety of substrates, including flexible, stretchable, porous, biodegradable, and/or biocompatible. This allows, for example, highly beneficial options in design of high resolution conductive patterns for a wide variety of applications.

The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.

In order to maintain high haze value of thermoplastic liquid crystalline polymer while to improve total light transmittance, provided is a thermoplastic liquid crystalline polymer molded body having a haze value of 99% or higher, and a thermal expansion coefficient of 16 to 27 ppm/° C., and satisfying a correlation between a light absorption coefficient (ε) and a thickness (x) as: ε≤0.21x.sup.−0.55.

A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.

The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.

A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm.sup.3/μm.sup.2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.