A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

An electro-optical device includes a plurality of digital scanning lines, a digital signal line, and a plurality of pixel circuits. Each of the pixel circuits includes a light emitting element and a digital driving circuit. The digital driving circuit performs digital driving to turn the light emitting element ON-state or OFF-state based on a grayscale value. The digital driving circuit keeps the light emitting element ON-state by supplying a drive current to the light emitting element, in a period in which an enable signal is active, of a grayscale display period having a length corresponding to the grayscale value. The control line driving circuit sets a period in which the enable signal is active. A ratio, with respect to the grayscale display period, of an ON-state period in which the light emitting element is ON-state changes in accordance with the period in which the enable signal is active.

An electro-optical device includes a plurality of digital scanning lines, a digital signal line, and a plurality of pixel circuits. Each of the pixel circuits includes a light emitting element and a digital driving circuit. The digital driving circuit performs digital driving to turn the light emitting element ON-state or OFF-state based on a grayscale value. The digital driving circuit keeps the light emitting element ON-state by supplying a drive current to the light emitting element, in a period in which an enable signal is active, of a grayscale display period having a length corresponding to the grayscale value. The control line driving circuit sets a period in which the enable signal is active. A ratio, with respect to the grayscale display period, of an ON-state period in which the light emitting element is ON-state changes in accordance with the period in which the enable signal is active.

A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.

Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.

A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

The present description relates to a method of manufacturing an electronic circuit (30) comprising: a support (32), an assembly site (31) having a first surface protruding from said support intended to be assembled to an assembly site of another electronic circuit by a self-assembly method; and a peripheral area (39) around said assembly site, the assembly site (31) comprising at least one level, each level comprising conductive pads (34) and insulating posts (380) between the conductive pads, said manufacturing method comprising the forming of said at least one level of the assembly site, such that the edges, in at least one direction (X) of the main plane (XY), of each level of the assembly site and the locations, in the at least one direction (X), of the conductive pads and of the insulating posts of the same level are defined in a same photolithography step of said method.

Tamper-respondent sensors with random three-dimensional security patterns and methods of fabrication are provided. The method includes establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume. The establishing includes obtaining in three-dimensions boundaries for the security circuit of the tamper-respondent sensor. The boundaries define a sensor volume within which the security circuit is to reside. The establishing also includes generating at least one trace configuration for the security circuit pattern. The at least one trace configuration defines a random, three-dimensional security pattern within the sensor volume, and the at least one trace configuration establishes, at least in part, the security circuit pattern. The process further includes fabricating the tamper-respondent sensor using, at least in part, the established security circuit pattern.

Tamper-respondent sensors with random three-dimensional security patterns and methods of fabrication are provided. The method includes establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume. The establishing includes obtaining in three-dimensions boundaries for the security circuit of the tamper-respondent sensor. The boundaries define a sensor volume within which the security circuit is to reside. The establishing also includes generating at least one trace configuration for the security circuit pattern. The at least one trace configuration defines a random, three-dimensional security pattern within the sensor volume, and the at least one trace configuration establishes, at least in part, the security circuit pattern. The process further includes fabricating the tamper-respondent sensor using, at least in part, the established security circuit pattern.