A circuit forming method for forming a circuit with a curable resin and a conductive fluid, the method including a setting step of setting errors that occur during a circuit forming work to an automatic release error and a non-release error for each type of error, the automatic release error being to be automatically released, and the non-release error being not to be automatically released, a determination step of determining whether an error has occurred in work when the circuit is formed, and a re-execution step of automatically re-executing work determined that the error has occurred in the determination step, in a case where the error of the work is set to the automatic release error in the setting step.

An oxide coating composition and a process for enhancing adhesion between a metal conducting layer and an in organic material or polymeric resin material using the oxide coating composition. The process includes the steps of applying the oxide coating composition to the metal conducting layer and bonding the inorganic material or polymeric resin material to the metal conducting layer. The oxide coating composition comprises (a) an alkali; (b) an oxidizing agent; (c) an acid; and (d) a corrosion inhibitor comprising a nitrogen heterocyclic compound;

An oxide coating composition and a process for enhancing adhesion between a metal conducting layer and an in organic material or polymeric resin material using the oxide coating composition. The process includes the steps of applying the oxide coating composition to the metal conducting layer and bonding the inorganic material or polymeric resin material to the metal conducting layer. The oxide coating composition comprises (a) an alkali; (b) an oxidizing agent; (c) an acid; and (d) a corrosion inhibitor comprising a nitrogen heterocyclic compound;

A conductor of the invention is in a form of a conductive convex portion in a laminated wiring member and includes a conductive material and a liquid repellent, in which the conductive material is in a form of metal particles, the liquid repellent is a fluorine-containing compound adapted to form a self-assembled monomolecular film. The conductor has a surface energy in a range from more than 30 mN/m to 80 mN/m. The conductor of the invention is exemplified by the conductive convex portion in the laminated wiring member and functions as a VIA post in the laminated wiring member.

A conductor of the invention is in a form of a conductive convex portion in a laminated wiring member and includes a conductive material and a liquid repellent, in which the conductive material is in a form of metal particles, the liquid repellent is a fluorine-containing compound adapted to form a self-assembled monomolecular film. The conductor has a surface energy in a range from more than 30 mN/m to 80 mN/m. The conductor of the invention is exemplified by the conductive convex portion in the laminated wiring member and functions as a VIA post in the laminated wiring member.

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

A 3D printed circuit apparatus includes a 3D printed circuit having a surface layer and one or more wires embedded under the surface layer, and a conductive metal pin that is cut to a desired length and inserted into the 3D printed circuit in order to attain contact with the wire or wires embedded under the surface layer.

The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.

The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.

In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.