An article is described herein which comprises a substrate, a character sequence disposed on the substrate, a scratch-off coating disposed at least in part over at least one portion of the character sequence, and at least one conductive trace disposed at least in part over the at least one portion of the character sequence.

An article is described herein which comprises a substrate, a character sequence disposed on the substrate, a scratch-off coating disposed at least in part over at least one portion of the character sequence, and at least one conductive trace disposed at least in part over the at least one portion of the character sequence.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

A position detection sensor includes a plurality of position detection loop coils formed on a board made of resin through a thermal process by forming a wiring path pattern made of copper paste that includes copper powder and a binder. Each of the position detection loop coils includes a plurality of first portions that extend on a first surface of the board in a first direction and a plurality of second portions that extend on a second surface of the board in a second direction that is orthogonal to the first direction. The wiring path pattern is disposed on the first surface and the second surface in a connector section that connects the position detection loop coils to external circuitry. The position detection sensor is capable of maintaining accuracy even though the loop coils are formed on the board by the thermal treatment using copper paste.

A position detection sensor includes a plurality of position detection loop coils formed on a board made of resin through a thermal process by forming a wiring path pattern made of copper paste that includes copper powder and a binder. Each of the position detection loop coils includes a plurality of first portions that extend on a first surface of the board in a first direction and a plurality of second portions that extend on a second surface of the board in a second direction that is orthogonal to the first direction. The wiring path pattern is disposed on the first surface and the second surface in a connector section that connects the position detection loop coils to external circuitry. The position detection sensor is capable of maintaining accuracy even though the loop coils are formed on the board by the thermal treatment using copper paste.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

An electronic module includes a three-dimensional wiring board including a cavity portion in which a bottom surface and four wall surfaces are formed, a plurality of electrodes being provided on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes and including a plurality of chip components and an image pickup module configured to pick up an image in an opening section direction of the cavity portion. A wall surface among the four wall surfaces that corresponds to a direction in which the plurality of chip components are arrayed is an inclined surface having an inclination with respect to the bottom surface.

An electronic module includes a three-dimensional wiring board including a cavity portion in which a bottom surface and four wall surfaces are formed, a plurality of electrodes being provided on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes and including a plurality of chip components and an image pickup module configured to pick up an image in an opening section direction of the cavity portion. A wall surface among the four wall surfaces that corresponds to a direction in which the plurality of chip components are arrayed is an inclined surface having an inclination with respect to the bottom surface.

Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.