The invention relates to an ultrasonic transducer (10) of the type comprising a housing (16) provided with an electrical connector (17), at least one ultrasonic transducer (15) and an electronic card (13) for controlling the transducer and which is arranged inside the housing and consists of a printed circuit board (14) on which active components (11) and passive components (12) are mounted. According to the invention, the active components include integrated active components (11) which are completely embedded in a substrate of the printed circuit board and the passive components include integrated passive components (12) which are completely embedded in the substrate. According to another feature, the active components and the passive components include surface-mounted components (7) arranged solely on one side of the printed circuit board and the transducer is mounted on an opposite side.

A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.

A tool for reforming printed circuit board backplane connector pins on a rod control system. The pin reforming tool of this invention is aligned into a card cage using existing card guides and locates itself around the backplane connector. The tool uses a uniquely designed die (that can be set up for one or multiple pin applications) that precisely engages into the connector and around the pin or pins to be reformed, with the assistance of a zig zag alignment guide matched specifically for the pin spacing. A consistent reforming force is applied via a force applicator structured to provide a force of a preselected magnitude.

Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

A printed circuit film includes: a base film including a first film portion extending in a first direction, a second film portion extending in the first direction, and a third film portion extending in the first direction; a plurality of lead wires extending in the second direction and disposed on the first, second, and third film portions, the plurality of lead wires being spaced apart from each other in the first direction; and a bonding member including: a conductive member disposed to overlap the plurality of lead wires on the first film portion; a first non-conductive member disposed to overlap the plurality of lead wires and the second film portion; and a second non-conductive member disposed to overlap the plurality of lead wires and the third film portion, wherein the conductive member is disposed between the first non-conductive member and the second non-conductive member in the second direction.

A printed circuit film includes: a base film including a first film portion extending in a first direction, a second film portion extending in the first direction, and a third film portion extending in the first direction; a plurality of lead wires extending in the second direction and disposed on the first, second, and third film portions, the plurality of lead wires being spaced apart from each other in the first direction; and a bonding member including: a conductive member disposed to overlap the plurality of lead wires on the first film portion; a first non-conductive member disposed to overlap the plurality of lead wires and the second film portion; and a second non-conductive member disposed to overlap the plurality of lead wires and the third film portion, wherein the conductive member is disposed between the first non-conductive member and the second non-conductive member in the second direction.

A circuit board includes a conductive plate held by a holding member, an insulation sheet provided on one side of the conductive plate, and a circuit component that is placed on the conductive plate and that has a terminal, and a void portion is formed in the insulation sheet, and a conductive material for electrically connecting the conductive plate and the terminal to each other is applied to a region that is exposed from the void portion on the one side of the conductive plate.

A circuit board includes a conductive plate held by a holding member, an insulation sheet provided on one side of the conductive plate, and a circuit component that is placed on the conductive plate and that has a terminal, and a void portion is formed in the insulation sheet, and a conductive material for electrically connecting the conductive plate and the terminal to each other is applied to a region that is exposed from the void portion on the one side of the conductive plate.

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.