A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 μm, in particular less than 60 μm, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 μm, in particular less than 60 μm, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.

A method for producing a labeled printed circuit board, as well as a labeled electric printed circuit board. In order to provide a method for producing a labeled printed circuit board that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate with conductor tracks is supplied, which is then coated with a functional lacquer layer on at least one surface. A labeling of the substrate in different color shades of the functional lacquer layer is also carried out.

A method for producing a labeled printed circuit board, as well as a labeled electric printed circuit board. In order to provide a method for producing a labeled printed circuit board that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate with conductor tracks is supplied, which is then coated with a functional lacquer layer on at least one surface. A labeling of the substrate in different color shades of the functional lacquer layer is also carried out.

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

A manufacturing method of a display device, includes: providing a display module bendable at a bending area and including: a passivation film including a polyimide and disposed both in and outside of the bending area, and an adhesive layer attaching a display panel to the passivation film and including a first adhesive portion in the bending area and a second adhesive portion outside of the bending area; reducing an adhesive force of the first adhesive portion, by irradiating a first laser which is a CO.sub.2 laser to the adhesive layer at the bending area, to provide the first adhesive portion which has reduced adhesive force; providing a groove in the passivation film and the adhesive layer, along a boundary of the bending area; and removing the passivation film and the first adhesive portion which has the reduced adhesive force, from the display panel, at the groove.

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.