A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

Apparatus and methods of automatically trimming a PCB-based LC circuit. The apparatus may comprise an interface to a printed circuit board (PCB). The PCB may include a PCB inductor and a PCB capacitor to form an LC circuit. The LC circuit may have an LC circuit frequency. The apparatus may comprise a variable capacitor communicatively coupled to the interface and configured to adjust an effective capacitance of the LC circuit.

A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a substrate, forming an electric circuit layer on the substrate at an elevated temperature, forming an opening in the transparent region and penetrating through a portion of the electric circuit layer, forming a light emitting unit on the electric circuit layer in the first region, and forming an insulating layer on the substrate. At least a part of the insulating layer is formed in the opening.

A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a substrate, forming an electric circuit layer on the substrate at an elevated temperature, forming an opening in the transparent region and penetrating through a portion of the electric circuit layer, forming a light emitting unit on the electric circuit layer in the first region, and forming an insulating layer on the substrate. At least a part of the insulating layer is formed in the opening.

A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top surface of the resin layer, and firing the metal-containing liquid.

A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top surface of the resin layer, and firing the metal-containing liquid.

The disclosure provides a bonding method, the bonding method includes: bonding first areas of a plurality of flexible printed circuit boards on a substrate, the plurality of flexible printed circuit boards being sequentially arranged along a direction parallel to a first side of the substrate, and a second area of each of the flexible printed circuit boards exceeds the first side; cutting at least one of the flexible printed circuit boards to enable second sides of all the flexible printed circuit boards to be flush and parallel to the first side, wherein each of the second sides is a side of the second area away from the first area; and bonding second areas of the flexible printed circuit boards with a connection circuit board.

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

A bending apparatus including a stage on which a bending object is positioned, a bending bar, a drive unit connected to the bending bar and configured to move the bending bar according to a standard route to bend the bending object by coming into contact with the bending object, and a measuring unit that measures a movement route of the bending bar.