A bending apparatus including a stage on which a bending object is positioned, a bending bar, a drive unit connected to the bending bar and configured to move the bending bar according to a standard route to bend the bending object by coming into contact with the bending object, and a measuring unit that measures a movement route of the bending bar.

A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.

A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.

A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.

An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.

An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.

Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.

An electro-optical apparatus includes an electro-optical panel having a first end portion, a first connector that is flexible, and a reinforcement member on the first connector. The first connector has a second end portion and a third end portion opposite to the second end portion. The second end portion is connected to the first end portion. The first connector has a first surface connected to the electro-optical panel, and a second surface opposite to the first surface. The reinforcement member is located on the first surface, and extends from an end surface at the first end portion of the electro-optical panel to the third end portion. The first connector has first and second side edges, at least one of which has a first cutout depressed inward. The first and second side edges connect the second and third end portions to each other.

An electro-optical apparatus includes an electro-optical panel having a first end portion, a first connector that is flexible, and a reinforcement member on the first connector. The first connector has a second end portion and a third end portion opposite to the second end portion. The second end portion is connected to the first end portion. The first connector has a first surface connected to the electro-optical panel, and a second surface opposite to the first surface. The reinforcement member is located on the first surface, and extends from an end surface at the first end portion of the electro-optical panel to the third end portion. The first connector has first and second side edges, at least one of which has a first cutout depressed inward. The first and second side edges connect the second and third end portions to each other.

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.