A controller for an e-machine of a turbomachine including a support structure, a printed circuit board, and a fastener arrangement that retains the printed circuit board on the support structure, the fastener arrangement including a resilient member that resiliently biases the printed circuit board towards the support structure.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

A surface mount component can include a first substrate and a second substrate arranged adjacent the first substrate to form a monolithic body. At least one of the first substrate or the second substrate can include a thermally conductive material that is electrically insulating. A thin film component can be arranged between the first substrate and the second substrate. A first terminal can be formed over a first end of the monolithic body. A second terminal can be formed over a second end of the monolithic body that is opposite the first end. A heat sink terminal can contact the thermally conductive material of the at least one of the first substrate or the second substrate.

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.