A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.

An image sensor attached to a printed circuit board is installed in a camera. A holder includes first and second rails comprising first and second printed circuit boards, respectively, and the holder is fastened to a lens mount of the camera. The holder may be fastened to captively hold the image sensor, and the image sensor may be resiliently supported when captively held. A gripper grasps the image sensor proximate to the holder and aligns the image sensor to an aligned position of the image sensor relative to the lens mount. The image sensor may be moved to the aligned position after directing an image toward the image sensor to produce a processed image for determining relative alignment. The printed circuit board is soldered to the first and/or second printed circuit board such that the holder fixedly holds the image sensor so it is unmovable in its aligned position.

An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

To protect memory cards, such as SD type cards, and similar devices from Electrostatic Discharge (ESD), the input pads of the device include points along their edges that are aligned with correspond points on a conductive frame structure mounted adjacent the input pad to form a spark gap. The input pads are connected to a memory controller or other ASIC over signal lines that include a diode located between the input pad and the ASIC and a resistance located between the input pad and the diode. The resistance and diode are selected such that an ESD event at an input pad triggers a discharge across the spark gap before it is transmitted on to the ASIC, while also allowing a high data rate for signals along the signal line.

An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

A method for producing a power semiconductor module arrangement includes: arranging at least one semiconductor substrate in a housing, each semiconductor substrate including a first metallization layer attached to a dielectric insulation layer, the housing including a through hole extending through a component of the housing; inserting a fastener into the through hole such that an upper portion of the fastener is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a mounting surface, the mounting surface comprising a hole, wherein the housing is arranged on the mounting surface such that the through hole is aligned with the hole in the mounting surface; and exerting a force on the printed circuit board such that the force causes the fastener to be pressed into the hole in the mounting surface so as to secure the housing to the mounting surface.

Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.