Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

An operator uses a handheld fastening tool to fasten a surface-mount technology printed-circuit board (PCB) to an adjacent object by installing a fastener at a target location on the PCB. The operator wears augmented-reality (AR) eyewear equipped with image-recognition technology. The system identifies the distance between the target location and the nearest electronic component mounted to the PCB. An accelerometer integrated into the fastening tool continuously monitors the inclination of the tool and the frequency of operator hand movements while holding the tool. The distance, inclination, and movement measurements are used to derive a composite score indicating a likelihood that the current fastening task will be completed successfully without damage. The eyewear represents the score to the operator as a color-coded AR object. The measurements, scores, and color coding are continuously updated to give the operator real-time feedback about the operator's current likelihood of success.

An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

An electric compressor includes: a circuit board on which a plurality of switching elements (33) are mounted; a compression mechanism which is driven by a motor operated using AC power output from the switching elements (33); and a lead holding member (50) disposed between element main bodies (33a) of the switching elements (33) and the circuit board. The circuit board includes a plurality of through-holes through which a plurality of leads (33b) that extend from the element main bodies (33a) can be respectively inserted. The lead holding member (50) includes lead insertion holes (53) through which the leads (33b) can be inserted such that positions of the leads (33b) is held at positions that correspond to positions of the through-holes.

In an example, a device includes: a printed circuit board (PCB); at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB; and at least one connector attached to the PCB at a third side of the PCB, wherein the device is configured to operate in a first speed from a plurality of operating speeds based on a first input received via the at least one connector.

A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.

A power semiconductor module includes a housing accommodating a power circuit with at least one power semiconductor chip, the housing providing at least two power terminals; a printed circuit board mounted to the housing and electrically connected to the power circuit for distributing auxiliary signals; and at least one auxiliary terminal mounted to the printed circuit board with a press-fit connection provided by a body of the auxiliary terminal.

Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.