Embodiments of the present disclosure provide a robot arm apparatus including a fastener for fastening a first electronic component to a second electronic component, and a movable part configured to move the fastener. The fastener includes an arm connected to the movable part, a head connected to the arm and configured to contact the first electronic component, and a lock configured to be in contact with the arm when the first electronic component is moved to a reference space, and to be spaced apart from the arm when the first electronic component is fastened to the second electronic component after the first electronic component is moved to the reference space.

Embodiments of the present disclosure provide a robot arm apparatus including a fastener for fastening a first electronic component to a second electronic component, and a movable part configured to move the fastener. The fastener includes an arm connected to the movable part, a head connected to the arm and configured to contact the first electronic component, and a lock configured to be in contact with the arm when the first electronic component is moved to a reference space, and to be spaced apart from the arm when the first electronic component is fastened to the second electronic component after the first electronic component is moved to the reference space.

Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.