A system for the assembly of circuit boards is shown. The system includes an assembly device and a circuit board. The assembly device comprises a substantially planar base plate and guide members. The circuit board includes multiple rigid portions connected by flexible members. The guide members extend into a space partially or completely enclosed in the horizontal direction by the circuit board, and determine the position and orientation of the rigid portions relative to the base plate.

A die package structure and a method for fabricating the same are provided. The method includes: fixing a first die on a package base; aligning first hollow pads of a flexible printed circuit board with first pads of the first die, and fixing the flexible printed circuit board; soldering the first hollow pads to the first pads; fixing a second die on the flexible printed circuit board to overlap with the first die; folding the flexible printed circuit board, such that second hollow pads of the flexible printed circuit board are aligned with second pads of the second die, and signal test pads of the flexible printed circuit board are exposed; fixing the flexible printed circuit board on the second die; soldering the second hollow pads to the second pads; soldering metal wires to the signal test soldering pads; and soldering package pins to the metal wires.

A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.

An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.

A component carrier includes a stack with an electrically conductive layer structure and an electrically insulating layer structure. The electrically conductive layer structure having a first plating structure and a pillar. The pillar has a seed layer portion on the first plating structure and a second plating structure on the seed layer portion. A method of manufacturing such a component carrier and an arrangement including such a component carrier are also disclosed.

A method for connecting a flexible printed circuit (FPC) to a battery module and a cell supervision circuit board (CSCB) is provided. The method includes: providing a coil of a continuous, strip-shaped FPC; unwinding a first section of the FPC from the coil, positioning the first section of the FPC over a first contact portion of the battery module, and welding a conductive structure of the FPC in the first section to the first contact portion of the battery module; unwinding a second section of the FPC from the coil, positioning the second section of the FPC over a contact pad of the CSCB, and welding the conductive structure of the FPC in the second section to the contact pad of the CSCB; and separating the first section and second section of the FPC from the coil of the FPC.

A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad.