This anisotropic conductive sheet has: an insulation layer that has a first surface and a second surface and that is formed of a first resin composition; a plurality of resinous columns that are formed of a second resin composition and that are disposed so as to extend in the thickness direction within the insulation layer; and a plurality of conductive layers that are disposed between the insulation layer and the plurality of resinous columns and that are exposed outside the second surface and the first surface.

The present invention is directed to flexible conductive articles (600) that include a printed circuit (650) and a stretchable or non-stretchable substrate (610). In some embodiments, the substrate has a printed circuit on both sides. The printed circuit contains N therein a porous synthetic polymer membrane (660) and an electrically conductive trace (670) as well as a non-conducive region (640). The electrically conductive trace is imbibed or otherwise incorporated into the porous synthetic polymer membrane. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable or non-stretchable substrate by adhesive dots (620). The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.

A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 μm to 0.5 μm, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

A method for producing a wiring board according to the present disclosure includes: (A) forming a first insulating material layer on a supporting substrate; (B) forming a first opening part in the first insulating material layer; (C) forming a seed layer on the first insulating material layer; (D) providing a resist pattern on a surface of the seed layer; (E) forming a wiring part including a pad and wiring; (F) removing the resist pattern; (G) removing the seed layer; (H) applying a first surface treatment to the surface of the pad; (I) forming a second insulating material layer; (J) forming a second opening part in the second insulating material layer; (K) applying a second surface treatment to the surface of the pad; and (L) heating the second insulating material layer to a temperature equal to or higher than the glass transition temperature of the second insulating material layer.

A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

A laminate comprising a substrate; an adhesive layer formed on at least one surface of both surfaces of the substrate so as to be in direct contact with the substrate; and a plating layer formed on a surface of the adhesive layer opposite to the substrate, wherein the adhesive layer comprises a plating catalyst containing a precious metal, and a silane coupling agent.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).