A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

A manufacturing method includes stacking, between two endless belts, a first sheet of metal foil, a plurality of insulating films, and a second sheet of metal foil in this order one on top of another and hot-press molding these sheets and films together to form an insulating layer out of the plurality of insulating films. Each of the plurality of insulating films has a first surface and a second surface. The second surface has a larger ten-point mean roughness (Rzjis) than the first surface. The absolute value of difference between a ten-point mean roughness (Rzjis) of a surface, in contact with the first sheet of metal foil, of the insulating layer and a ten-point mean roughness (Rzjis) of another surface, in contact with the second sheet of metal foil, of the insulating layer is equal to or less than 0.35 μm.

A manufacturing method includes stacking, between two endless belts, a first sheet of metal foil, a plurality of insulating films, and a second sheet of metal foil in this order one on top of another and hot-press molding these sheets and films together to form an insulating layer out of the plurality of insulating films. Each of the plurality of insulating films has a first surface and a second surface. The second surface has a larger ten-point mean roughness (Rzjis) than the first surface. The absolute value of difference between a ten-point mean roughness (Rzjis) of a surface, in contact with the first sheet of metal foil, of the insulating layer and a ten-point mean roughness (Rzjis) of another surface, in contact with the second sheet of metal foil, of the insulating layer is equal to or less than 0.35 μm.

A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure, and a component embedded in the cavity and arranged on the stepped metal structure. A bottom side of the stepped metal structure has a flat surface extending continuously along at least one horizontal direction.

A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/μm.

A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor, and a coating film. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is formed in contact with the connection conductor and that the wiring pattern is covered by the coating film, the conductor pad has a surface facing the second insulating layer and having first surface roughness higher than surface roughness of a surface of the wiring pattern, and the coating film has opening exposing a portion of the surface of the conductor pad from the coating film and having area larger than area of interface between the conductor pad and the connection conductor and that the connection conductor is formed on the portion of the surface of the conductor pad and is separated from the coating film.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

Methods and apparatus to improve adhesion between metals and dielectrics in circuit devices are disclosed. An apparatus includes a metal layer, a dielectric layer adjacent the metal layer, and a polymeric bonding layer at an interface between the metal layer and the dielectric layer. A polymer molecule in the polymeric bonding layer including an R1 group, an R2 group, and a polymer chain extending between the R1 group and the R2 group. The R1 group is different than the R2 group. The polymeric bonding layer is bonded to the metal layer via the R1 group. The polymeric bonding layer is bonded to the dielectric layer via the R2 group.

Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a Kurtosis (Rku) of the first surface ranges from 3.0 to 60.0. With the Rku, the LCP film is able to improve the peel strength with a metal foil and ensure that a laminate comprising the same maintains the merit of low insertion loss.

Description of a method and equipment for panel (900) treatment in the manufacture of printed circuit boards that includes the following phases: setting up a panel (900) with a first side (905), a second side (910) opposite the first side, and at least one through hole (915) in the thickness of the panel; positioning the opening (205) for an intake system (200) in contact with the first side (905) of the panel (900) so this opening (205) delimits a portion on the first side (905) containing the through hole (915); creating negative pressure within the intake system (200) and simultaneously exposing at least one portion on the second side (910) of this panel (900) to a flow of plasma, whereby this portion on the second side (910) contains the through hole (915).