The invention relates to a process for producing a metal-ceramic substrate (1), comprising: providing a ceramic element (10) and a metal layer, providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer, forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).

The invention relates to a process for producing a metal-ceramic substrate (1), comprising: providing a ceramic element (10) and a metal layer, providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer, forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).

A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

A laminated body includes: a supporting base material; an adhesive layer; a metal layer; and a substrate in this order. The metal layer contains at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum. The metal layer preferably contains at least one metal selected from the group consisting of copper, titanium, palladium, gold, and nickel.

An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.

A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on the insulator polymer base layer; b) applying a layer of photoresist on the metal trace layer and patterning the metal trace layer and forming metal traces on the insulator polymer base layer; c) activating the insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with the base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of the insulator polymer layer and selective etching the insulator layer and the top coating layer to obtain at least one via; and e) filling the via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width. The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.

A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

A plated molded article 1 is characterized in that a partial region R in a surface 21 of a base material 2 is provided with a plurality of non-penetrating holes 4 of substantially corresponding shapes and substantially corresponding sizes that are formed in a scattered pattern in such a manner as to be separated from each other at a substantially averaged hole density, and a plated part 3 is formed while filling the non-penetrating holes 4 and is provided continuously over the partial region R in such a manner as to extend across the non-penetrating holes 4. It is possible to obtain a plated molded article capable of forming a required plated part in a short time on a surface of a base material and capable of improving smoothness of an outer surface of the plated part and adhesion property of the plated part.

A plated molded article 1 is characterized in that a partial region R in a surface 21 of a base material 2 is provided with a plurality of non-penetrating holes 4 of substantially corresponding shapes and substantially corresponding sizes that are formed in a scattered pattern in such a manner as to be separated from each other at a substantially averaged hole density, and a plated part 3 is formed while filling the non-penetrating holes 4 and is provided continuously over the partial region R in such a manner as to extend across the non-penetrating holes 4. It is possible to obtain a plated molded article capable of forming a required plated part in a short time on a surface of a base material and capable of improving smoothness of an outer surface of the plated part and adhesion property of the plated part.