A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the insulating resin base material layers, and a ground conductor overlapping the plurality of the signal lines as viewed from the laminating direction. Openings are provided in the ground conductor and, as viewed from the laminating direction, an aperture ratio is higher in an inner zone that is sandwiched between two signal lines than in an outer zone of the two signal lines.

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

A method of forming a self-aligned electrical winding includes forming a first conductive turn in a first conductive layer around a planned leg hole and forming a second conductive turn in a second conductive layer around the planned leg hole. The method includes stacking a plurality of conductive layers aligned with each other, and separated from each other by at least one intervening insulation layer into a multilayer PCB stack. The method includes forming the planned leg hole through the multilayer PCB by removing the respective conductive portions of the first conductive turn and second conductive turn that extend into the planned leg hole. Forming the leg hole defines a first inner circumference for the first conductive turn and a second inner circumference for the second conductive turns, wherein the first inner circumference is aligned with the second inner circumference through forming the leg hole.

A method of forming a self-aligned electrical winding includes forming a first conductive turn in a first conductive layer around a planned leg hole and forming a second conductive turn in a second conductive layer around the planned leg hole. The method includes stacking a plurality of conductive layers aligned with each other, and separated from each other by at least one intervening insulation layer into a multilayer PCB stack. The method includes forming the planned leg hole through the multilayer PCB by removing the respective conductive portions of the first conductive turn and second conductive turn that extend into the planned leg hole. Forming the leg hole defines a first inner circumference for the first conductive turn and a second inner circumference for the second conductive turns, wherein the first inner circumference is aligned with the second inner circumference through forming the leg hole.

The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.

The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.

A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and-the second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.

A circuit board has an electrical circuit and a connector that is attached to the circuit board. The connector has metal contacts. A housing of the connector has an embedded reference metal layer that is disposed under a single-ended metal contact or differential metal contacts. The reference metal layer sets the impedance of the single-ended metal contact or the differential metal contacts.

The present invention discloses a method for coating and forming a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid film on a copper foil; (2) delivering the same to a tunnel oven for roasting, and forming a cured film on the copper foil to obtain a single-sided board; (3) coating a layer of synthetic liquid high-frequency material on the cured film; and (4) delivering the same to the tunnel oven for roasting until the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer so as to obtain a novel material layer structure of a high-frequency circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to make a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to circuit board preparation and simplifies the process.

The present invention discloses a method for coating and forming a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid film on a copper foil; (2) delivering the same to a tunnel oven for roasting, and forming a cured film on the copper foil to obtain a single-sided board; (3) coating a layer of synthetic liquid high-frequency material on the cured film; and (4) delivering the same to the tunnel oven for roasting until the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer so as to obtain a novel material layer structure of a high-frequency circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to make a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to circuit board preparation and simplifies the process.