A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are electrically connected to the first bridge end and the second bridge end, respectively; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion for a first functional wiring line on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively. The wiring layout of the flexible printed circuit is simple and is easy to be manufactured.

A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.

A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region. The connection region further includes an electrically-insulating second top rigid-layer and a plurality of connector bond-pads each exposed on a top surface of the second top rigid-layer facing away from the top substrate-surface in the connection region, and electrically connected to a respective device bond-pad via at least one of the electrically conductive layers.

A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

A terrestrial vehicle lighting module which includes an electroluminescent source including at least one electroluminescent element, an electronic device designed to control the electroluminescent element, and an interposer electrically connecting the electroluminescent source and the electronic device.

Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.

A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.

A flexible resonant trap circuit is provided that includes a transmission line arranged to include a helical winding that has a first helical winding segment and a second helical winding segment; and a capacitor coupled between the first and second helical winding segments.

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.