A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic device may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

A wiring substrate is a wiring substrate including a plurality of differential pairs. Each of the differential pairs includes a first signal conductor, a first connection portion connected to the first signal conductor via a first via, a second signal conductor, and a second connection portion connected to the second signal conductor via a second via. The first signal conductor and the second signal conductor are arranged on different planes parallel to a bottom surface of the wiring substrate and overlap in a vertical direction. The first connection portion and the second connection portion are arranged on a top surface of the wiring substrate at a predetermined interval in a signal transmission direction. Adjacent differential pairs among the plurality of differential pairs are arranged at a predetermined interval in the signal transmission direction and at a predetermined interval in a direction perpendicular to the signal transmission direction.

A wiring board includes a first wiring layer disposed on the first adhesion layer; and a second wiring layer disposed on the second adhesion layer, wherein a proportion of copper remaining in the first wiring layer is represented by C=B/A (%), where A is a total area of the first wiring layer, B is an area of copper in the first wiring layer, and C is a remaining copper ratio C defined as the proportion of copper remaining in the first wiring layer, and wherein when the remaining copper ratio C is set to 70 to 100%, the first adhesion layer is comprised of at least one material having a first predetermined Young's modulus, and the first wiring layer is comprised of at least one material having a second predetermined Young's modulus, the first predetermined Young's modulus being 0.1 to 0.85 times the second predetermined Young's modulus.

Compounds containing, in one molecule thereof, a structure represented by formula (1), a structure represented by formula (2), and a structure represented by formula (3) (all the symbols are those described in the specification).

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are useful as epoxy resin curing agents.

A board main body includes first and second resin layers contacting each other and including thermoplastic resin, a first signal conductor layer on an upper main surface of the second resin layer, an overlapping region in which the first and second resin layers are present when viewed in an up-down direction, and a non-overlapping region in which the first resin layer is not present and the second resin layer is present when viewed in the up-down direction. The first signal conductor layer includes a first curved portion in which the first signal conductor layer is curved in the up-down direction such that the first signal conductor layer in the first non-overlapping region is above the first signal conductor layer in the overlapping region. The first signal conductor layer is electrically connectable to an element on the board main body in the first non-overlapping region.