A connection structure for a wiring substrate and a flexible substrate including a wiring substrate and a flexible substrate, in which the wiring substrate includes an insulating member, conductor layer, and ground layer, the flexible substrate includes an insulating sheet and metal film, and the metal film includes a signal line pad joined to the conductor layer via a joining material when viewed from the back surface of the flexible substrate. When viewed from behind the flexible substrate, there is an overlap region where the signal line pad and conductor layer overlap. In a cross-section when the overlap region is cut in a direction perpendicular to a signal transmission direction, in a case where a width of the signal line pad including the overlap region is W, and a width of the conductor layer including the overlap region is W.sub.0, the connection structure satisfies W.sub.0<W.

A vehicular glass module (1) includes a vehicular window glass (2) having a conductive pattern (4) formed thereon and an on-glass connector (3) attached to the vehicular window glass (2). The on-glass connector (3) includes a hollow portion (11) and a circuit board (6) disposed in the hollow portion (11). The hollow portion (11) is in communication with an outside of the case (5) via a through hole (15) provided in a partition wall (14) defining a part of the hollow portion (11). The through hole (15) is positioned lower than the circuit board (6). The water generated in the hollow portion (11) by condensation is discharged to the outside via the through hole (15).

A control arrangement and a control module for a milking position for milking a dairy animal includes a casing forming an inner space enclosing a printed circuit board incorporating a control system for controlling and supervising at least some functions of the milking position. A communication area is provided on a front side of the printed circuit board and communicates with the control system. The casing includes an inner front plate. The front side of the printed circuit board is attached to a rear side of the inner front plate by a transparent adhering substance so that a part of the printed circuit board projects from the rear side of the inner front plate. The inner front plate permits access to the communication area. The part of the printed circuit board is embedded in a block of plastic material.

The present invention provides a rollable display device and a rollable display apparatus. The rollable display device includes a rollable display panel and at least one main flexible circuit board. The rollable display panel includes a driving portion having at least one connection portion. The connection portion includes a wiring region including a plurality of external lines, and one end of each of the external lines is connected to the display region. The main flexible circuit board is arranged corresponding to a flexible connector, and a width of the main flexible circuit board is less than a predetermined value.

An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer information pertaining to the electrical connector arrangement. The storage device also has contacts that enable the physical layer information to be read from the storage device by a media reading interface. A connector assembly includes at least one receptacle assembly; a printed circuit board; and a media reading interface.

A cable connector module includes a housing having a cavity and a cable connector module received in the cavity. The cable connector module includes a circuit card having rows of signal contact pads on a mounting surface. The cable connector module includes cable assemblies terminated to the circuit card arranged in rows each having a cable and a ground clip coupled to an end of the cable. The cable connector module includes a cable holder coupled to the housing that holds the cables assemblies relative to each other within the cavity of the housing.

This application provides a display card including a circuit board, a fan, and a cover body. The fan is disposed on the circuit board. The cover body covers the circuit board and includes a top wall. The top wall includes a first covering portion and a second covering portion. The first covering portion includes an opening to expose the fan. The second covering portion is connected to the first covering portion, and bends towards the circuit board.

A vehicular exterior rearview mirror assembly includes a mirror head accommodating a mirror reflective element. The mirror head is adjustably mounted at a mounting base configured for attachment at a side of a vehicle. A plurality of cameras are disposed at the mounting base and includes (i) a rearward viewing camera that views at least rearward of the vehicle and (ii) a downward viewing camera that views at least downward. The mirror head accommodates an electronic accessory. A wire harness passing through the mounting base to the mirror head includes individual wires that terminate at respective first, second, and third electrical connectors. The accessory is electrically connected to a power source of the vehicle via the first connector. The rearward and downward viewing cameras respectively connect to the second and third connectors to receive electrical power from the power source and provide image data to an electronic control unit.

Disclosed herein is a sensor module that includes a substrate having a top surface and a back surface, a sensor element mounted on the top surface of the substrate, an external terminal formed on the back surface of the substrate, and a case fixed to the substrate so as to cover the sensor element. The case has a top plate part having a plurality of through holes. The top plate part has a center area having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area.

An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.