A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360 allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

Enclosure parts for portable information handling systems may be made by heat pressing material layers together. The material layers may include outer fiber-reinforced thermoplastic layers and a core thermoplastic layer comprising a plurality of thermoplastic film layers. The core thermoplastic layer may be die cut to create voids that reduce weight of the enclosure part. A finishing layer may be added, along with attachment features.

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

A surface mount type device includes: an electronic component, a main substrate on which the electronic component is mounted, a pedestal on which the main substrate is mounted, a lower substrate on which the pedestal is mounted, and a cover mounted on the lower substrate so as to cover the pedestal. The soldering pattern is soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate. The pedestal includes a cut-out portion in a side surface portion so as to form a space above the soldering pattern. The cover is secured to the soldering pattern by a solder formed in the space.

A laminate-type power storage element is configured of an exterior body that is formed in a flat bag shape by welding a first laminated film and a second laminated film by thermocompression bonding, and an electrode body that is sealed inside the exterior body, the electrode body having a sheet-shaped positive electrode and a sheet-shaped negative electrode. The first laminated film and the second laminated film respectively includes a first resin layer that has a property of transmitting a laser beam, a metal foil that is layered to the first resin layer, and a second resin layer is layered to the metal foil and has a thermal weldability.

A physiological signal measurement device includes a housing, a bracket, a rigid circuit board fastened in the housing, a first flexible circuit board assembled in the housing and the in-ear portion, and a protective sleeve. The housing protrudes frontward to form an in-ear portion. The bracket has a base portion fastened to the in-ear portion. Several portions of a front surface of the base portion protrude frontward to form a plurality of first elastic portions. The first flexible circuit board has a resilient end. The resilient end of the first flexible circuit board surrounds the plurality of the first elastic portions. The protective sleeve has a fastening portion, and a plurality of second elastic portions protruded from the fastening portion. The plurality of the second elastic portions surround the plurality of the first elastic portions and the resilient end of the first flexible circuit board.

A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.

An electric range is provided that may include an elastic holder to fix a fuse and a sensor in a central portion of an induction heating unit disposed over/on/in an upper portion of a base plate, thereby stably fixing the fuse and sensor against external impact. In the electric range, an upper end of the sensor may come into close contact with a lower surface of a cover plate disposed over/on/in an upper portion of the induction heating unit, thereby stably measuring a temperature of the cover plate and absorbing an external impact.

The TIC environmental event sensor is a nickel-sized, ultra-thin circuit assembly, containing an extremely compact array of both environmental sensors and physical sensors, along with local and wireless access to all the sensor data, including BTLE & LoRa, as well as an electronic ink display for limited field access to sensor events in real time. The TIC is designed to capture changes in the sensor data in real time, and then log it for future examination. The most recent change will remain on the device's display. The changes can then be transmitted to a smart phone or tablet via BTLE, networked as an asset via LoRa, or locally scrolled at the device. The TIC is Ideal for tracking any variations in the surrounding conditions of an asset's travel, storage or use.

Disclosed is an electronic part package body including a carrier tape having a plurality of electronic part housing portions arranged in a longitudinal direction, and a cover tape covering at least the electronic part housing portions by being laminated to the carrier tape. The carrier tape includes a first bonded portion and a second bonded portion that are arranged on outsides of both end portions of the plurality of electronic part housing portions, both end portions being end portions in a width direction of the carrier tape, and are arranged in the longitudinal direction of the carrier tape. One of or both the first bonded portion and the second bonded portion include a reentrant part disposed so as to be continuous from the outside of an electronic part housing portion to a region between electronic part housing portions.