A card holder includes a card tray, a card cover and a first connecting rod. The card tray is configured to accommodate a data card. The card cover is rotatably connected to the card tray, and includes opposite first and second ends and a first protrusion extending towards the card tray. The first connecting rod has an end connected to the card tray and another end rotatably connected to the card cover, and is configured to rotate relative to the card cover such that the card cover approaches to or is away from the card tray. When the card holder is inserted into a housing and a pushing force is applied to the first end, the card cover is rotatable about the first protrusion such that the first end extends further into the housing and the second end extends out of the housing. An electronic device is also provided.

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

A housing assembly encasing an electromagnetic component includes a housing part, a bulkhead wall inserted into the housing part in an insertion direction, a locking sub-assembly locking the bulkhead wall to the housing part, and a glue transport channel formed between the bulkhead wall and the housing part. The housing part has a first wall section and a second wall section opposite the first wall section. The bulkhead wall extends from the first wall section to the second wall section in a horizontal direction in an inserted state in the housing part.

To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), R is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons). ##STR00001##

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360 allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360 allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

Disclosed is a clothes care apparatus capable of preventing the spreading of fire when a fire occurs on a printed circuit board (PCB) assembly. The clothes care apparatus may comprise: a PCB assembly; a PCB housing having an accommodation space for accommodating the PCB assembly, the PCB housing including a sidewall that forms the accommodation space; and a protective body filled into the accommodation space to cover the PCB assembly, wherein the sidewall may include guide wall having a height lower than or equal to a height of the protective body filled in the accommodation space.

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360? allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.