H05K5/0091

PACKAGE STRUCTURE

A package structure is provided. The package structure includes an electronic component, a heat dissipating element, a thermal interfacing unit, and a confining structure. The electronic component has an upper surface. The heat dissipating element is over the upper surface of the electronic component. The thermal interfacing unit is between the upper surface of the electronic component and the heat dissipating element. The thermal interfacing unit includes a thermal interfacing material (TIM). The TIM is attached to the confining structure by capillary force.

Communication apparatus

In a communication apparatus, an analog circuit includes a circuit element to be connected to a first conductor, and processes a differential signal. A communication circuit receives, via a connection circuit, a differential signal processed by the analog circuit, and generates a signal for which the potential of a second conductor is used as a reference potential based on the received differential signal. An inductor is connected between the first conductor and the second conductor. The connection circuit includes a circuit element different from a capacitor. The analog circuit (21), the connection circuit, the communication circuit, the inductor, the first conductor, and the second conductor are housed in a conductive housing box.

SURFACE MOUNT TYPE DEVICE AND MANUFACTURING METHOD FOR THE SAME
20180270978 · 2018-09-20 · ·

A surface mount type device includes: an electronic component, a main substrate on which the electronic component is mounted, a pedestal on which the main substrate is mounted, a lower substrate on which the pedestal is mounted, and a cover mounted on the lower substrate so as to cover the pedestal. The soldering pattern is soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate. The pedestal includes a cut-out portion in a side surface portion so as to form a space above the soldering pattern. The cover is secured to the soldering pattern by a solder formed in the space.

WIRELESS WEARABLE ELECTRONIC DEVICE COMMUNICATIVELY COUPLED TO A REMOTE DEVICE
20180254546 · 2018-09-06 ·

Disclosed is a wireless wearable electronic device having an antenna that communicatively couples the wearable electronic device to another wearable electronic device and to a remote, portable device. The antenna is generally shaped like a loop or ring, has a bow with respect to the plane of the loop or ring and operates in conjunction with the ground planes of the printed circuit boards in proximity to the antenna to form a principal omni-directional lobe about the ear of the user and a secondary lobe downwardly directed from the head of the user to communicate with the remote device.

Tic environmental event sensor
12119540 · 2024-10-15 · ·

The TIC environmental event sensor is a nickel-sized, ultra-thin circuit assembly, containing an extremely compact array of both environmental sensors and physical sensors, along with local and wireless access to all the sensor data, including BTLE & LoRa, as well as an electronic ink display for limited field access to sensor events in real time. The TIC is designed to capture changes in the sensor data in real time, and then log it for future examination. The most recent change will remain on the device's display. The changes can then be transmitted to a smart phone or tablet via BTLE, networked as an asset via LoRa, or locally scrolled at the device. The TIC is Ideal for tracking any variations in the surrounding conditions of an asset's travel, storage, or use.

Junction Box for Multiple LED Drivers
20180209624 · 2018-07-26 ·

Junction boxes for enclosing and making electrical connections to multiple LED drivers are disclosed. The junction boxes include a bottom or base and a cover. Dividers arising from the base divide the junction box into high-voltage and low-voltage compartments. A cut-out open at the top of each divider allows drivers to be placed in a junction box without having to pull wires through holes or openings. Typically, the base is open along two sidewalls, with the cover being U-shaped to complete the enclosure. Various mounting mechanisms are disclosed for securing drivers within junction boxes.

METHODS OF PACKAGING MICROELECTRONIC DEVICES UTILIZING PANELS AND RELATED TEMPORARY STRUCTURES
20240357747 · 2024-10-24 ·

Methods may involve supporting a plurality of microelectronic dice on a printed circuit panel. Respective microelectronic dice of the plurality of microelectronic dice may be electrically connected to at least one via of the printed circuit panel. Microelectronic device packages may be singulated from the printed circuit panel, respective microelectronic device packages including at least one microelectronic die of the plurality of microelectronic dice and a portion of the printed circuit panel. Structures may include a plurality of microelectronic dice supported on a printed circuit panel. The printed circuit panel may include vias, subsets of the vias positioned for electrical connection to a respective microelectronic die of the plurality of microelectronic dice.

Feedthrough assembly with feature for controlling component position

In some examples, a feedthrough assembly for a medical device may include a ferrule. The ferrule defines an aperture extending through the ferrule from an outer end surface defined by the ferrule to an end inner end surface defined by the ferrule. The aperture includes a first portion having a first diameter and a second portion having a second diameter less than the first diameter. The aperture defines a longitudinal axis extending therethrough and the ferrule defines a ledge between the first and second portions of the aperture that extends radially inward toward the longitudinal axis. The feedthrough assembly further may include a conductive pin within the aperture and an insulating member surrounding at least a portion of the pin. The insulating member may electrically insulate the conductive pin from the ferrule, and the ledge and a surface of the insulating member adjacent the ledge may define a space therebetween.

Glass enclosure
10021798 · 2018-07-10 · ·

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

Hearing device interface

A hearing device interface for a wired connection between a hearing device and an external device is disclosed. In particular an interface for a hearing aid. The interface comprises a first group of electrically conducting contact pins extending parallel to each other and being configured to engage with a corresponding plug of the external device provided with plug slots, wherein the interface further comprises a second electrically conducting contact pin extending parallel to the first group of electrically conducting contact pins.