A heat dissipating structure includes an integrated circuit; a bracket; a heat sink; a housing; a first fastening member that is inserted into a first fastening hole provided to the bracket, and is inserted into a fastening hole provided to the heat sink, and that assembles the integrated circuit to the bracket and the heat sink, while a surface of the integrated circuit contacts with the bracket, and another surface contacts with the heat sink; and a second fastening member that is inserted into a second fastening hole provided to the bracket, and into a fastening hole provided to the housing, and assembles the bracket to the housing. The heat sink includes one surface that contacts with the housing, the one surface being on a side opposite to a surface contact with the integrated circuit, and the one first fastening member is positioned spaced from the housing.

A body of a memory card reader, which has an overall rectangular parallelepiped shape including a slot for inserting a memory card. The reader body includes, on a rear surface thereof, a recess for receiving a memory card connector, the receiving recess being of a predetermined volume shape and including at least one conductive track.

A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically coupling the substrate and the sensor chip, a frame fixed on the substrate, and a light-permeable layer that is disposed on the frame. The light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment. The ring-shaped segment is disposed on a top end surface of the frame, so that the light-permeable layer, the frame, and the substrate jointly define an enclosed space that accommodates the sensor chip and the metal wires therein. The ring-shaped segment has an inner ring-shaped roughened region that is arranged on an inner surface thereof and that is fixed onto the top end surface of the frame. Moreover, an inner edge of the inner ring-shaped roughened region is arranged in the enclosed space.

The present disclosure provides a liquid loading device for loading liquid into a product. The product includes a cavity and a liquid inlet communicated with the cavity. The liquid loading device includes a loading module to load liquid into the cavity through the liquid inlet. A sensor senses a pressure in the cavity and generates at least one pressure value. A controller is coupled to the sensor and the loading module, and controls the loading module to operate based on related data. In addition, the present disclosure also provides a liquid loading method.

A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

A circuit assembly (600) includes a printed circuit board assembly (100). The printed circuit board assembly includes a first circuit board (101), a second circuit board (102), and a first flexible substrate (103) interposed between, and continuous with, the first circuit board and the second circuit board. A second flexible substrate (108) extends from, and is continuous with, the second circuit board. One or more electronic circuits comprising electronic components (301,302,303,304,305) are disposed along one or more of the first circuit board or the second circuit board. The printed circuit board assembly is folded about a battery (601), with the first circuit board adjacent to the first major face, the second circuit board adjacent to the second major face, and the first flexible substrate spanning the one or more side faces.

A laminate-type power storage element is configured of an exterior body that is formed in a flat bag shape by welding a first laminated film and a second laminated film by thermocompression bonding, and an electrode body that is sealed inside the exterior body, the electrode body having a sheet-shaped positive electrode and a sheet-shaped negative electrode. The first laminated film and the second laminated film respectively includes a first resin layer that has a property of transmitting a laser beam, a metal foil that is layered to the first resin layer, and a second resin layer is layered to the metal foil and has a thermal weldability.

An insert casing for receiving and fastening an electrical or electronic component includes a first casing part which is connectable to a second casing part by means of a rotary joint. The casing parts define a receiving space for the electrical or electronic component. The first casing part is provided with at least one spreading member which is spreadable by the second casing part when the rotary joint is being closed. The insert casing can be fastened easily in a recess of an object by closing the rotary joint.

A power module includes a first board comprising a first surface and a second surface opposite to each other and perpendicular to a bottom surface of the power module for mounting the power module to a circuit board, the bottom surface providing electrical connections to the circuit board, a first charge pump assembly mounted on the first surface, the first charge pump assembly comprising a first power conversion circuit configured to convert an input voltage to an output voltage, and a first vertical heatsink structure arranged adjacent to the first charge pump assembly, the first charge pump assembly being placed between the first vertical heatsink structure and the first board.