A package for housing a semiconductor element includes a base body including a bottom plate section and a frame-shaped side wall section; and an input/output terminal provided so as to pass through the side wall section, the input/output terminal having a plate section on which line conductors are formed, and a vertical wall section which is fixed to the plate section so as to continue to the side wall section and so that the line conductors are sandwiched between the plate section and the vertical wall section and both ends of the line conductors are exposed from the vertical wall section. The vertical wall section has a thick section in a center portion of a side surface of the vertical wall section in a direction along the side wall section, the thick section having thick wall thickness, a lower end of the thick section being fixed to the plate section.

An electronic device package box is mounted with multiple coil components, is mounted on a circuit board, and includes a box unit, and multiple outer and inner connecting pins. The box unit includes inner and outer surrounding walls, a surrounding base wall connected between the inner and outer surrounding walls, and a surrounding space for receiving the coil components therein. The outer connecting pins are mounted to the outer surrounding wall, and each is connected to a corresponding one of the coil components and the circuit board. The inner connecting pins are mounted to the inner surrounding wall, and each is connected to a corresponding one of the coil components and the circuit board.

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

The protective housing can cover at least one component on the circuit board; the interior of the cover has several protrusions that are built, so that at least one part is displaced by raising the protective housing on at least one component, so that it is in contact with the exterior contour of the component and fastens it. Moreover, a circuit board is provided with at least one protective housing.

Disclosed herein are nanoscale devices comprising one or more ferroelectric nanoshells characterized as having an extreme curvature in at least one spatial dimension. Also disclosed are ferroelectric field effect transistors and metal ferroelectric metal capacitors comprising one or more ferroelectric nanoshells. Methods for controlling spontaneous ferroelectric polarization in nanoshell devices are also disclosed.

An electrical assembly may include a bus bar assembly, a sensor assembly, including a circuit board connected to the bus bar assembly, and a sensor, a bracket connected to the bus bar assembly, and a cooling member connected to the bracket. A method of assembling an electrical assembly may include connecting a shunt resistor with a bus bar assembly, connecting a circuit board with the bus bar assembly, connecting the bus bar assembly with the bracket, disposing the cooling member on or about the bracket, and/or connecting the cooling member with the bracket.

This disclosure relates to a seal for a power module and an electric energy conversion and transmission device. The seal for the power module comprising a housing having a first side surface and a second side surface opposite to each other and pins sticking out of the first side surface, the seal comprises a peripheral wall extending continuously in the circumferential direction to define a accommodating space, which is adaptable for accommodating the power module, the peripheral wall is elastic and has a first end and a second end opposite to each other, and the peripheral wall is configured such that when the power module is completely accommodated in the accommodating space, the first end of the peripheral wall is at least higher than the first side surface of the housing.

Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

Devices and methods for protecting an electronic circuit. A device includes a base frame, an electronic circuit, and a cage frame depending from the base frame. The cage frame is configured to provide physical protection on at least four sides for the electronic circuit. The cage frame also defines a plurality of openings configured to provide air circulation across the electronic circuit. The device also has at least one fan disposed within the cage frame and configured to at least partially drive the air circulation. A method involves providing the above components. These devices and methods are able to be further adapted to provide for the retrofit of an installed electronics device.

Embodiments of the invention provide a container (e.g., marker tip holder box) that comprises a holding pad (e.g., marker tip holder pad) having a plurality of holders to retain objects (e.g., marker tips for use with a pen-stylus). Each holder has an opening to receive an object (e.g., a marker tip). Each holder further comprises a flexible leaflet, that surrounds the opening in the holder, wherein the flexible leaflet has an irregular but nearly conical shape that narrows in diameter as it approaches an arrester that is located below the flexible leaflet, such that a retained object rests in the arrester in the holder. The flexible leaflet has two states, a first state that holds the retained object (e.g., a marker tip) with sufficient firmness to retain the object in the holder, and a second state in which the irregular but nearly conical shape of the flexible leaflet interferes with an outer housing of the object retained in the holder to form a flexure that enables removal of the retained object from the container.