A composite aluminum alloy plate for a case of an electronic product contains: a first aluminum alloy plate and a second aluminum alloy plate. The first aluminum alloy plate is made of first aluminum alloy material, and the second aluminum alloy plate is made of second aluminum alloy material. The first aluminum alloy material is selected from any one of 6XXX series aluminum alloy to 8XXX series aluminum alloy, and the second aluminum alloy material is selected from any one of 1XXX series aluminum alloy to 5XXX series aluminum alloy. The first and second aluminum alloy plates are stacked and compounded by hot rolling so as to produce the composite aluminum alloy plate having an external layer, an intermediate layer, and an internal layer. Thereafter, the composite aluminum alloy plate is laminated by cold rolling and is stabilized in a tempering treatment.

A composite aluminum alloy plate for a case of an electronic product contains: a first aluminum alloy plate and a second aluminum alloy plate. The first aluminum alloy plate is made of first aluminum alloy material, and the second aluminum alloy plate is made of second aluminum alloy material. The first aluminum alloy material is selected from any one of 6XXX series aluminum alloy to 8XXX series aluminum alloy, and the second aluminum alloy material is selected from any one of 1XXX series aluminum alloy to 5XXX series aluminum alloy. The first and second aluminum alloy plates are stacked and compounded by hot rolling so as to produce the composite aluminum alloy plate having an external layer, an intermediate layer, and an internal layer. Thereafter, the composite aluminum alloy plate is laminated by cold rolling and is stabilized in a tempering treatment.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

The present application describes apparatuses, systems, and methods for robust, adaptable, and deployable computing devices and radio systems. In one aspect, the present application describes a chassis for housing electronic componentry. The chassis includes a frame with a top plate and a bottom plate, an interface panel located on the chassis frame; a back panel located on the chassis frame opposite the interface panel, and a protective protrusion located at a corner of the chassis frame extending beyond the top plate and the bottom plate.

In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.

In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.

The present application discloses an electronic apparatus including an apparatus frame having an aperture; a door movably secured to the apparatus frame and configured to be movable between a first position at which the aperture is accessible and a second position at which the aperture is substantially closed; and a communication socket at least partially enclosed by the apparatus frame; the communication socket having a plurality of communication terminals configured to be accessible for electrical connection with an external apparatus through the aperture. The communication socket includes a first member, the door includes a second member, the first member and the second member being magnetically attractive to each other and cooperatively configured to secure the door in the second position.

A data management system includes a chassis metalwork that is electrically conductive. The chassis metalwork is electrically coupled to the power supply to form a return power path. The return power path may include a sub-chassis frame and a drawer frame. The return power path may also include uninsulated return power cables. The return power cables may be maintained in a cable chain along with outgoing power cables and data cables. The return power cables may be coupled to the drawer frame and the sub-chassis frame.

A data management system includes a chassis metalwork that is electrically conductive. The chassis metalwork is electrically coupled to the power supply to form a return power path. The return power path may include a sub-chassis frame and a drawer frame. The return power path may also include uninsulated return power cables. The return power cables may be maintained in a cable chain along with outgoing power cables and data cables. The return power cables may be coupled to the drawer frame and the sub-chassis frame.