A fire-resistant electrical box assembly includes an outer box assembly having an outer top panel, an outer bottom panel, an outer first side panel, an outer second side panel, an outer back panel, an inner back panel, and a front panel forming an opening substantially covered by a front cover, an inner box assembly having one or more of an inner top panel, an inner bottom panel, an inner first side panel, and an inner second side panel, and an intumescent material between at least a portion of the outer back panel and the inner back panel.

The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices.

The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.

The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.

The present disclosure provides an electronic product metal shell and a method of manufacturing the same. The electronic product metal shell includes: a metal layer; a first hard anodic oxidation layer formed on an upper surface of the metal layer; a second hard anodic oxidation layer formed on a lower surface of the metal layer; an antenna groove penetrating through the metal layer and the first hard anodic oxidation layer; and a non-conductive material filled in the antenna groove.

The present disclosure provides an electronic product metal shell and a method of manufacturing the same. The electronic product metal shell includes: a metal layer; a first hard anodic oxidation layer formed on an upper surface of the metal layer; a second hard anodic oxidation layer formed on a lower surface of the metal layer; an antenna groove penetrating through the metal layer and the first hard anodic oxidation layer; and a non-conductive material filled in the antenna groove.

In order to transmit high frequency energy to a coupling circuit, if the high frequency energy is transmitted via a harness provided with a high-voltage cable, the loop in which the high frequency energy is conducted is long, and thus, noise occurring from the loop is increased. Thus, shielding is needed to be provided to the entire apparatus. The present invention has a structure in which: a high frequency energy supply circuit and a coupling circuit are connected by a connection member; and a housing having therein the high frequency energy supply circuit is integrated with a housing having therein the coupling circuit. Accordingly, the entire apparatus can be downsized and noise occurring from the loop can be reduced.

In order to transmit high frequency energy to a coupling circuit, if the high frequency energy is transmitted via a harness provided with a high-voltage cable, the loop in which the high frequency energy is conducted is long, and thus, noise occurring from the loop is increased. Thus, shielding is needed to be provided to the entire apparatus. The present invention has a structure in which: a high frequency energy supply circuit and a coupling circuit are connected by a connection member; and a housing having therein the high frequency energy supply circuit is integrated with a housing having therein the coupling circuit. Accordingly, the entire apparatus can be downsized and noise occurring from the loop can be reduced.

Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.