This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.

A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

The present disclosure provides a display device including a display apparatus. The display apparatus includes: a side frame; at least two display modules installed on the side frame and including a first display module and a second display module, display screens of the display modules facing a same direction; and a back housing installed on the side frame. An accommodation space is formed between the back housing and the side frame, the first display module is disposed in the accommodation space, a first surface of the back housing away from the display screen and a second surface of the second display module away from the display screen are located on a same plane and form an outer surface of the display apparatus away from the display screen, and the second display module is a display module other than the first display module among the at least two display modules.

The present disclosure provides a display device including a display apparatus. The display apparatus includes: a side frame; at least two display modules installed on the side frame and including a first display module and a second display module, display screens of the display modules facing a same direction; and a back housing installed on the side frame. An accommodation space is formed between the back housing and the side frame, the first display module is disposed in the accommodation space, a first surface of the back housing away from the display screen and a second surface of the second display module away from the display screen are located on a same plane and form an outer surface of the display apparatus away from the display screen, and the second display module is a display module other than the first display module among the at least two display modules.

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.

According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.

An embodiment modular light-emitting diode (LED) display panel includes attachment points for use in attachment as part of a multi-panel modular LED display, a printed circuit board including a first side and an opposite second side, and a plastic casing attached to the opposite second side of the printed circuit board. A perimeter of the plastic casing is substantially rectangular and has a height and a width. The modular LED display panel further includes a display surface including a plurality of LEDs arranged as pixels and attached to the first side of the printed circuit board. The pixels are arranged in a rectangular array including at least fifty pixels. Each of the pixels of the rectangular array is spaced from each respective adjacent pixel of the rectangular array by a pitch. The pitch is a predetermined constant number. The pitch does not depend on the height and the width.