A clad material (30) includes a first layer (31) made of stainless steel, a second layer (32) made of Cu or a Cu alloy and roll-bonded to the first layer, and a third layer (33) made of stainless steel and roll-bonded to a side of the second layer opposite to the first layer. The clad material has an overall thickness of 1 mm or less, and in a cross-sectional view along a stacking direction, a minimum thickness of the first layer in the stacking direction and a minimum thickness of the third layer in the stacking direction are 70% or more and less than 100% of an average thickness of the first layer in the stacking direction and an average thickness of the third layer in the stacking direction, respectively.

Embodiments of the present disclosure generally relate to housings and enclosures for electronic devices and memory devices, and more specifically to such housings and enclosures having nickel-boron coatings and processes for forming such nickel-boron coatings. In an embodiment is provided an article for housing at least a portion of an electronic device that includes a metal-containing substrate, and a layer comprising nickel and boron, the layer disposed on at least a portion of the metal-containing substrate, wherein: an amount of nickel in the layer is about 95 wt % or more and an amount of boron in the layer is about 5 wt % or less based on the total amount of nickel and boron in the layer. The article has a thermal conductivity of about 25 W/mK or more, a scratch hardness of about 0.5 GPa or more, a coefficient of friction of about 0.4 or less, or combinations thereof.

Embodiments of the present disclosure generally relate to housings and enclosures for electronic devices and memory devices, and more specifically to such housings and enclosures having nickel-boron coatings and processes for forming such nickel-boron coatings. In an embodiment is provided an article for housing at least a portion of an electronic device that includes a metal-containing substrate, and a layer comprising nickel and boron, the layer disposed on at least a portion of the metal-containing substrate, wherein: an amount of nickel in the layer is about 95 wt % or more and an amount of boron in the layer is about 5 wt % or less based on the total amount of nickel and boron in the layer. The article has a thermal conductivity of about 25 W/mK or more, a scratch hardness of about 0.5 GPa or more, a coefficient of friction of about 0.4 or less, or combinations thereof.

A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.

Provided is an opto-electric transmission composite module capable of efficiently dissipating heat of an opto-electric conversion portion,An which includes an opto-electric hybrid board configured to be optically and electrically connected to an opto-electric conversion portion and including an optical waveguide and an electric circuit board in order toward one side in a thickness direction; a printed wiring board electrically connected to the electric circuit board; a heat dissipating layer; and a casing made of metal, the casing accommodating the opto-electric hybrid board, the printed wiring board, and the heat dissipating member, the casing including a first wall are provided. The first wall, the heat dissipating layer, a portion of the printed wiring board, and the opto-electric hybrid board are disposed in order toward one side in the thickness direction. The heat dissipating layer is in contact with the first wall and the printed wiring board.

Provided is an opto-electric transmission composite module capable of efficiently dissipating heat of an opto-electric conversion portion,An which includes an opto-electric hybrid board configured to be optically and electrically connected to an opto-electric conversion portion and including an optical waveguide and an electric circuit board in order toward one side in a thickness direction; a printed wiring board electrically connected to the electric circuit board; a heat dissipating layer; and a casing made of metal, the casing accommodating the opto-electric hybrid board, the printed wiring board, and the heat dissipating member, the casing including a first wall are provided. The first wall, the heat dissipating layer, a portion of the printed wiring board, and the opto-electric hybrid board are disposed in order toward one side in the thickness direction. The heat dissipating layer is in contact with the first wall and the printed wiring board.

A heat sink for a solid-state drive (SSD) storage device for use as an extended memory in an expansion slot of a gaming console has a metal top plate of sufficient width and length to cover the exterior opening of the expansion slot. The top plate has fins on its upper surface that extend at a diagonal across the longitudinal extent of the top plate. The heat sink further includes a metal bulk body connected to the bottom of the top plate and having a sufficient width and length to nearly fill the interior of the expansion slot and a thickness so that when the heat sink is mounted on the SSD storage device, the top plate is positioned above the upper edge of the expansion slot. A thermal adhesive is provided on the bottom of the bulk body for fastening the heat sink to the top of the SSD storage device.

A heat sink for a solid-state drive (SSD) storage device for use as an extended memory in an expansion slot of a gaming console has a metal top plate of sufficient width and length to cover the exterior opening of the expansion slot. The top plate has fins on its upper surface that extend at a diagonal across the longitudinal extent of the top plate. The heat sink further includes a metal bulk body connected to the bottom of the top plate and having a sufficient width and length to nearly fill the interior of the expansion slot and a thickness so that when the heat sink is mounted on the SSD storage device, the top plate is positioned above the upper edge of the expansion slot. A thermal adhesive is provided on the bottom of the bulk body for fastening the heat sink to the top of the SSD storage device.

A metal enclosure for electrical components may include a rear panel and four side panels coupled with adhesive to form a bonded case having a cavity with a front opening. Channels of the four side panels may be joined to form a case channel circumscribing the opening. The case channel may be recessed towards a center of the opening so as to not extend radially beyond an envelope formed by planes of main panes of the four side panels of the one of the two adjoined panels or the one of the two separate panels. A door may be hingedly connected to one of the four side panels and may have one or more latches installed thereon. When the door is closed, a gasket engages a main panel of the door and a front surface of the case channel to seal the metal enclosure.

A metal enclosure for electrical components may include a rear panel and four side panels coupled with adhesive to form a bonded case having a cavity with a front opening. Channels of the four side panels may be joined to form a case channel circumscribing the opening. The case channel may be recessed towards a center of the opening so as to not extend radially beyond an envelope formed by planes of main panes of the four side panels of the one of the two adjoined panels or the one of the two separate panels. A door may be hingedly connected to one of the four side panels and may have one or more latches installed thereon. When the door is closed, a gasket engages a main panel of the door and a front surface of the case channel to seal the metal enclosure.