Patent classifications
H05K5/06
Waterproof electronic device and manufacturing method thereof
A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.
Control and power module for brushless motor
A power tool including an electric motor is provided. The tool includes a substantially disc-shaped printed circuit board (PCB), power switches mounted on the PCB; magnetic sensors mounted on the PCB facing the motor; a heat sink in thermal communication with the power switches disposed between the PCB and the electric motor; and a molded casing structurally securing the heat sink relative to the PCB. The molded casing includes a center opening, at least one first opening provided at a first radial distance from the center opening arranged to receive the magnetic sensors therein, and at least one second opening provided at a second radial distance from the center opening arranged to securely receive the heat sink therein.
Flameproof housing
A housing according of the flameproof encapsulation protection type having a housing body which has an opening closed by a cover. The opening is surrounded by a flange which is directed outward away from the housing body. The edge of the cover lies flat on the flange. The edge and the flange are both preferably continuous. In any case, the edge and the flange do not have any passage openings for clamping means. In order to clamp the edge against the flange, clamps are provided which hold the edge and the flange pressed against each other in the manner of screw clamps. The clamps are provided with releasable clamping means and are preferably captively retained on the housing body or the cover, the clamps being movable between a closed position, in which the cover is fixedly clamped, and an open position, in which the clamps do not extend over the cover and allow the cover to be opened unhindered.
Mechatronic Component and Method for the Production Thereof
The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side . A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.
HERMETIC SEALING LID MEMBER AND ELECTRONIC COMPONENT HOUSING PACKAGE
This hermetic sealing lid member (1) is made of a clad material (10) including a base material layer (11) made of an Fe alloy that contains 4 mass % or more of Cr and a silver brazing layer (13) bonded onto a surface of the base material layer on a side closer to an electronic component housing member through an intermediate layer (12).
Fluid measuring or fluid control device
A fluid measuring or fluid control device has a housing the housing parts of which are fastened to each other by at least one screwed connection, in which a screw engages through an opening in a peripheral wall of the first housing part and is screwed into a threaded opening in the second housing part. An elastic seal is arranged between the housing parts. The first housing part has a first resting face, and the second housing part has a second resting face which are both in peripherally circumferential contact with the seal. The screw shank and an edge of the opening have cooperating frustoconical surfaces which are oriented such that the second housing part is displaced in the direction towards the first housing part when the screw is screwed into the threaded opening, the resting faces coming into contact with the seal.
Display module and display device
A display module and a display device which can improve a heat-dissipation performance and a shock absorption function while reducing a bezel area, and in particular, reduce an impact applied to an edge of a cushion plate, and reduce deterioration in the shock absorption function due to moisture. A chamfer is formed along an edge of a metal foam included in the cushion plate to implement the improvement. Thus, a spacing between the edge of the cushion plate and a frame is maximized such that the impact applied to the edge of the cushion plate can be reduced as much as possible. Further, a rear face of a body and a chamfer of the metal foam can be covered with a water-proof layer, such that moisture invasion into the cushion plate can be reduced as much as possible.
HERMETIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A hermetic structure includes a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side, a conductor inserted through the through-hole, a protector component fit in the tapered portion, the protector component having a hole for inserting the conductor, and a glass member provided in the through-hole, on the low pressure side from the protector component, so as to seal the conductor.
HERMETIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A hermetic structure includes a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side, a conductor inserted through the through-hole, a protector component fit in the tapered portion, the protector component having a hole for inserting the conductor, and a glass member provided in the through-hole, on the low pressure side from the protector component, so as to seal the conductor.
POLYMER BONDING WITH IMPROVED STEP COVERAGE
A system and method for packaging an electronic device are provided. The packaged electronic device may include a structure material having one portion with a first lateral cross-section, and at least one other portion with a second lateral cross-section, where at least one of a dimension and a shape of the second lateral cross-section is different than in the first lateral cross-section.