The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.

A housing for storing therein a circuit board, includes: a through hole; an electrically conductive pattern passing through inner walls of the through hole so as to be stretched from the outside surface of the housing to the inside surface of the housing, and being electrically connected to the circuit board; and a plug member with which the through hole is filled, the through hole having openings on the outside and the inside, respectively, of the housing, and the opening on the outside of the housing being larger than the opening on the inside of the housing.

A pressure compensator for providing pressure compensation for a chamber of a subsea device is provided. The pressure compensator has an enclosure with at least an outer wall. A first compensation chamber is provided inside the enclosure. A flow connection from the first compensation chamber towards the chamber of the subsea device is further provided. As second compensation chamber is provided inside the enclosure. First and second separating walls are arranged inside the enclosure. A first bellows portion of the first separating wall and a second bellows portion of the second separating wall are deformable to provide pressure compensation between the chamber of the subsea device and a second inner volume around which the second separating wall extends.

A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, at a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about −20° C. to about 120° C., by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes wirelessly transmitting the sensor data to the computing system via the secure wireless connection using the wireless communication circuit. The diagnostic disc includes a disc-shaped body, a printed circuit board (PCB), a power source coupled to the PCB, a casing that encapsulates the power source, and a cover positioned over the PCB and the power source.

Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

A power tool including an electric motor is provided. The tool includes a substantially disc-shaped printed circuit board (PCB), power switches mounted on the PCB; magnetic sensors mounted on the PCB facing the motor; a heat sink in thermal communication with the power switches disposed between the PCB and the electric motor; and a molded casing structurally securing the heat sink relative to the PCB. The molded casing includes a center opening, at least one first opening provided at a first radial distance from the center opening arranged to receive the magnetic sensors therein, and at least one second opening provided at a second radial distance from the center opening arranged to securely receive the heat sink therein.

A variety of improvements to portable electronic devices are disclosed, particularly electronic devices designed for use in and around water. The improvements include a more secure interface jack, improved waterproofing techniques, improved battery stability, and improved device functionality. One or more of the disclosed improvements may be incorporated into a variety of portable electronic devices.

An electronic assembly, including an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto the sections of the adjoining casing parts abutting the gap region and bridges the gap region.

An inertial measurement device includes: a first inertial sensor; a first inertial sensor module in which the first inertial sensor is stored in a first package made of resin; a base having a concave portion and made of ceramic; and a lid body. The first inertial sensor module is accommodated in an accommodation space between the base and the lid body and is hermetically sealed.

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.