A toy is disclosed. The toy includes a toy building block, a snap-together electronic toy, and an adapter. The toy building block includes a first building block mating member. The snap-together electronic toy includes a first snap-fitting member. The adapter is configured to connect the toy building block to the snap-together electronic toy. The adapter includes a second building block mating member which is configured to mate with the first building block mating member of the toy building block, and a second snap-fitting member which is configured to mate with the first snap-fitting member of the snap-together electronic toy.

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

A toy is disclosed. The toy includes a toy building block, a snap-together electronic toy, and an adapter. The toy building block includes a first building block mating member. The snap-together electronic toy includes a first snap-fitting member. The adapter is configured to connect the toy building block to the snap-together electronic toy. The adapter includes a second building block mating member which is configured to mate with the first building block mating member of the toy building block, and a second snap-fitting member which is configured to mate with the first snap-fitting member of the snap-together electronic toy.

A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

The present invention discloses a modularized circuit for isolated circuit, wherein the isolated circuit includes at least two circuit components connecting in parallel and/or series, the circuit components, according to a circuit connection configuration, weld corresponding pins of the components directly, forming an integrated module in accordance with a desired connection method of the circuit, and saving circuit boards and wires; the circuit components are designed as a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped. Due to constructing a circuit unit by welding connections in a way of building blocks, welding directly between components in a 3D space, comparing to the circuits limited in a circuit board plane as a PCB, it owns a wider design space.

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.

A display device may include a display panel, and first member, and a second member. The display panel has a first section and a second section. The first member includes an electromagnet, extends parallel to the first section and has a first side and a second side. The first side is oriented a first obtuse angle with respect to the second side. The second member directly contacts the first member, extends parallel to the second section, and has a third side and a fourth side. The third side is oriented a second obtuse angle with respect to the fourth side. The first member is connected through the second member to the second section. The second member is connected through the first member to the first section.