A substrate unit of an embodiment includes a plurality of substrates and a holding part. The plurality of substrates are arranged at a constant interval in a thickness direction. The holding part integrally holds the plurality of substrates and allows, relative to one substrate of the plurality of substrates, another substrate to be movable along a plane direction of the substrate.

The power unit includes: a substrate having a first side surface at a first side thereof; a tablet structure located at the first side of the substrate; and a power structure configured to be pressed against the first side surface by the tablet structure. The power unit uses the tablet structure to press the power structure against the first side surface of the substrate, thereby achieving a firm and reliable installation of the power structure on the substrate.

The power unit includes: a substrate having a first side surface at a first side thereof; a tablet structure located at the first side of the substrate; and a power structure configured to be pressed against the first side surface by the tablet structure. The power unit uses the tablet structure to press the power structure against the first side surface of the substrate, thereby achieving a firm and reliable installation of the power structure on the substrate.

A base station interface device including an interface board, which is located in a housing and determines an upper portion of a first surface as a first mounting location and an upper portion of a second surface opposite to the first surface as a second mounting location, including a relay connector wherein one end is exposed to the upper portion of the first surface and the other end is exposed to the upper portion of the second surface; a base station signal matching unit mounted on the first mounting location and including a first connector coupled to the one end of the relay connector; and a base station signal processing unit mounted on the second mounting location and including a second connector coupled to the other end of the relay connector.

A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

A printed circuit board includes a substrate and a plurality of pad forming regions disposed thereon. The plurality of pad forming regions are spaced apart from each other by a predetermined distance. A plurality of connection pads are disposed on a portion of the plurality of pad forming regions. The plurality of connection pads are configured to transmit or receive a signal to an external device or from the external device. The printed circuit board includes a path configured for the transportation of moisture therein.

A ruggedized engine control module (ECU) system includes a plugin-pod, a connector configured to connect the plugin-pod to a connector of an ECU, and signal processing circuitry. The ruggedized ECU system further includes a ruggedized enclosure for the connector and the signal processing circuitry. The ruggedized enclosure is configured to mount the plugin-pod to the ECU. The connection circuit includes signal processing circuitry configured to receive signals from at least one of the connectors, process the signals, and output the processed signals. The ruggedized ECU is configured to dissipate heat from the signal processing circuitry.

A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.

A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.