A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

Methods and devices for selectively presenting a user interface in a dual screen device. More particularly, the method includes providing a gallery for the dual screen device. The gallery can present one or more images in a user interface. The gallery user interface can adapt to changes in the device configuration. Further, the gallery can display images or videos in the various configurations.

Methods and devices for selectively presenting a user interface in a dual screen device. More particularly, the method includes providing a gallery for the dual screen device. The gallery can present one or more images in a user interface. The gallery user interface can adapt to changes in the device configuration. Further, the gallery can display images or videos in the various configurations.

Disclosed is a circuit unit with a novel structure that can counter the heat generation by resistors while suppressing an increase in size and cost of the circuit unit. A circuit unit includes a wiring member, a lower case that holds the wiring member, an upper case that covers the lower case, and resistors connected to the wiring member, wherein the upper case include wall portions that surround peripheries of the resistors, and wherein, in a first orthogonal direction orthogonal to the longitudinal direction of the resistors, the separation distance between intermediate portions in the longitudinal direction of the resistors and the wall portions of the upper case is greater than the separation distance between end portions in the longitudinal direction of the resistors and the wall portions of the upper case.

A sample holder includes: a pedestal made of metal; and a PCB (Printed Circuit Board) placed on the pedestal. The PCB includes a through opening that penetrates from a front surface to a rear surface of the PCB. The pedestal includes a cavity bottomed and with a top of the pedestal opened, the cavity formed at a portion corresponding to directly under the through opening on a side of the pedestal on which the PCB is placed. As a configuration on the side on which the PCB is placed, viewed from above, a part of the cavity is protruded outward from the through opening.

A sample holder includes: a pedestal made of metal; and a PCB (Printed Circuit Board) placed on the pedestal. The PCB includes a through opening that penetrates from a front surface to a rear surface of the PCB. The pedestal includes a cavity bottomed and with a top of the pedestal opened, the cavity formed at a portion corresponding to directly under the through opening on a side of the pedestal on which the PCB is placed. As a configuration on the side on which the PCB is placed, viewed from above, a part of the cavity is protruded outward from the through opening.

An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.

A motor drive control device for electric power steering includes: a switching element for supplying current to a motor; a smoothing capacitor for reducing ripple current due to the switching element; a control board on which a drive circuit for controlling the switching element and a control circuit capacitor are mounted; a control signal line for supplying a control signal from the control board to the switching element; an electric connection member electrically connecting the switching element and the smoothing capacitor; and a heatsink portion in which the switching element is arranged in an embedded manner, wherein the electric connection member is arranged between the switching element and the control board, and the control circuit capacitor and the smoothing capacitor are arranged in a space between the electric connection member and the control board.

A system and apparatus for energy storage/delivery device mounting. In one embodiment, the apparatus comprises a mounting plate comprising (i) a plurality of plate mounting features for securing the mounting plate to at least one structure; (ii) a plurality of spatial alignment features for spatially aligning the mounting plate with a second mounting plate; and (iii) at least one energy storage/delivery device mounting feature for mating with a corresponding feature of the energy storage/delivery device to removably mount the energy storage/delivery device on the mounting plate.

The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.