An electronic component package includes: a lower package, including a frame including a through-hole and a through-wiring, a first electronic component disposed in the through-hole of the frame, a redistribution layer disposed below the first electronic component and the frame and electrically connected to the first electronic component, and an encapsulant filling the through-hole to encapsulate the first electronic component; an upper package disposed on the lower package and including a second electronic component; and a passive element disposed between the upper package and the lower package.

The present disclosure provides a positioning frame for mounting a display module and a display panel. The positioning frame includes: a plurality of side plates enclosing an accommodation zone for receiving the display module; a support bed provided on at least a pair of side plates arranged opposite to each other, and connected perpendicularly with the side plates, for supporting the display panel of the display module; baffles corresponding to the support beds one by one, the baffles are provided at the display side of the display panel, perpendicularly connected with the side plate and arranged to be parallel with the support bed, for limiting the display panel in the normal direction; limiting holes provided in the baffle and support bed at least at one side; limiting element being plugged in the limiting hole for limiting the display in peripheral directions. The positioning frame enables effective assembling the display module.

A bumper cap assembly for an electrically adjustable hydraulic shock absorber. The bumper cap assembly includes a printed circuit board assembly and a bumper cap. The printed circuit board assembly includes power drive electronics and is electrically coupled to the shock absorber. The bumper cap defined a gap, wherein the printed circuit board assembly is housed within the gap.

A bumper cap assembly for an electrically adjustable hydraulic shock absorber. The bumper cap assembly includes a printed circuit board assembly and a bumper cap. The printed circuit board assembly includes power drive electronics and is electrically coupled to the shock absorber. The bumper cap defined a gap, wherein the printed circuit board assembly is housed within the gap.

An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.

An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.

A manufacturing method of a display device includes locating a base member on a support substrate; and removing a part of the support substrate by preventing a first surface portion having a predetermined region in a border plane between the support substrate and the base member from being irradiated with laser light through the support substrate, whereas irradiating a second surface portion, other than the predetermined region, in the border plane between the support substrate and the base member with the laser light through the support substrate.

A manufacturing method of a display device includes locating a base member on a support substrate; and removing a part of the support substrate by preventing a first surface portion having a predetermined region in a border plane between the support substrate and the base member from being irradiated with laser light through the support substrate, whereas irradiating a second surface portion, other than the predetermined region, in the border plane between the support substrate and the base member with the laser light through the support substrate.

A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

One example provides a composite. The composites includes a core layer comprising a thermoplastic polymer and having a first and a second sides opposite to each other; a first set of two layers disposed over at least a portion of the core layer respectively on the first and the second sides, each layer of the first set including carbon fibers aligned in a first direction in a plane; and a second set of two layers disposed over at least a portion of the first set of two layers respectively on the first and the second sides, each layer of the second set including carbon fibers aligned in a second direction perpendicular to the first direction in the plane In the plane, the composite has a length and a width, the length larger than the width and parallel to the second direction.