A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

Electrical equipment comprising a cover, a circuit board, and a heatsink arranged to dissipate heat produced by the circuit board outwards from the electrical equipment, the heatsink comprising at least one free fin and at least one fastener fin, the electrical equipment being such that, when the electrical equipment is assembled, the free fin(s) extend(s) outwards from the electrical equipment without being covered by the cover, and the cover is snap-fastened to the fastener fin(s).

Provided is an electronic device including an antenna module. The electronic device may include: a housing constituting an external appearance of the electronic device, a support member including a first bridge, a printed circuit board coupled to one surface of the support member, a first antenna constituting a first part of the housing and connected to the support member through the first bridge, a second antenna constituting a second part of the housing, a cut-off portion separating the first antenna and the second antenna, and a first connection member and a second connection member coupled to the first bridge. The first connection member may be connected to a ground of the printed circuit board through a first capacitor and may be disposed closer to the cut-off portion than the second connection member connected to the ground of the printed circuit board through a second capacitor. Other embodiments are also possible.

Tools and techniques are described to automate commissioning of physical spaces. Controllers have access to databases of the devices that are controlled by them, including wiring diagrams and protocols, such that the controller can automatically check that each wire responds correctly to stimulus from the controller. Controllers also have access to databases of the physical space such that they can check that sensors in the space record the correct information for device activity, and sensors can cross-check each other for consistency. Once a physical space is commissioned, incentives can be sought based on commissioning results.

Disclosed is a system and a method for connecting at least one electronic card to an electronic board of a computer device, the system including an electronic board, equipped with a plurality of connectors for connecting at least one electronic cards to the electronic board, and slots for connecting at least one component to the electronic board. The at least one electronic card are substantially perpendicular to the electronic board. The system further includes a first supporting means being configured such that the at least one electronic card is first mounted onto the first support before the first support is placed above the electronic board in the vertical direction. The system further includes a second support installed underneath the electronic board in the vertical direction. The system includes further ejection mechanism and insertion mechanism. The system for connecting may include a plurality of electronic boards.

An apparatus including a frame forming an interface device configured for connection to a test chassis, and at least one interface connector coupled to the frame, the at least one interface connector corresponding to connectors of a unit under test, the interface device being configured for insertion through one or more sealable apertures of an environmentally protective chassis that houses the test chassis, and coupling to an interface device seating surface of the environmentally protective chassis without any intervening environmental interface or environmental interface plane located between the interface device seating surface and the test chassis, wherein the frame forming the interface device includes a first end plate configured with electrical connectors and mechanical attachment members configured to align and attach a circuit card to the interface device.

An uninterruptible power supply system includes a plurality of functional modules interconnected to form a power distribution network coupling at least two power sources to a load. Each functional module has at least two ports coupled to at least one other of the functional modules and/or to at least one other external device and includes a control circuit configured to autonomously control at least one function relating to electrical power transfer between the at least two ports. The system further includes a controller module configured to communicate with each of the functional modules over at least one digital communication link to control power flow between the at least two power sources and the load.

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.