A housing for use with line replaceable modules includes a housing body, an access cover associated with the housing body, a guide body disposed within the housing body, a guide cam disposed within the guide body, wherein the guide cam includes at least one guide feature, a clamping cam in sliding contact with the guide cam, wherein the clamping cam includes at least one follower to interface with the at least one guide feature, and an actuating lever associated with the clamping cam to interface with the access cover, wherein the actuating lever translates the clamping cam relative to the guide cam.

A cable management unit including a support assembly for mounting a patch panel, such as to a wall. The support assembly may include first and second anchor members adapted to be anchored to the wall, and first and second support arms hingedly coupled to the first and second anchor members at first and second hinge points, respectively. The first and second support arms may be adapted to be coupled to the patch panel. A chassis the patch panel may be supported by the first and second support arms. The first and second support arms may be configured to pivot about the first and second hinge points respectively between storage and access positions. The first and second support arms may extend outward from the wall in the access position and may be substantially parallel to the wall in the storage position.

The present disclosure describes a telecommunications equipment mount. The mount includes a stabilization frame having a bottom and at least three sides, the bottom and sides defining an open interior cavity, at least one mounting member perpendicular to one of the sides of the stabilization frame and extending outwardly from the side of the stabilization frame a distance, and at least one brace member. The at least one brace member includes a first bracket coupled to one side of the stabilization frame and configured to be secured to the at least one mounting member and a second bracket extending outwardly from the same side of the stabilization frame at an angle. A first end of the second bracket is coupled to a lower end of the first bracket and a second opposing end of the second bracket is configured to be secured to the at least one mounting member at a different location than the first bracket. The stabilization frame is configured to ballast the mount on a mounting structure when telecommunications equipment is secured to the mount. Telecommunications equipment mount assemblies are also described herein.

A cable management system includes a mounting bracket having a backing plate, two face mounts, and a panel, said face mounts each include an orifice and an aperture of different inner diameter, said panel includes a number of openings and a number of holes of different inner diameter, a extender bracket includes two walls and two end pieces secured together, said walls and said end pieces each include an eyelet and a piercing of different inner diameter, a fastening member includes a backing plate insert for engaging with said orifice of said face mounts and said eyelet of said walls and said end pieces of said extender brackets, a screw hole formed in said fastening member and formed through said backing plate insert, and an inner thread formed in said fastening member and spaced from said screw hole and said backing plate insert for engaging with bolts.

A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

A semiconductor package includes a semiconductor die with an active surface and an inactive surface, the active surface including metal pillars providing electrical connections to functional circuitry of the semiconductor die, and a backside metal layer on the inactive surface. The backside metal layer is attached to the inactive surface. The semiconductor package further includes a plurality of leads with each of the leads including an internal leadfinger portion and an exposed portion that includes a bonding portion. Distal ends of the metal pillars are in contact with and electrically coupled to the internal leadfinger portions. The backside metal layer is exposed on an outer surface of the semiconductor package. The bonding portions and the backside metal layer approximately planar to each other.

A mounting rail is provided that includes a DIN rail and one or more heating cable channels. A channel defined by the DIN rail may include one of the heating cable channels. Heating cables may be installed in the heating cable channels using adhesive and/or heat transfer material to form an electronics heating module. The heating cables may be self-regulating heating cables. The mounting rail may include multiple heat transfer fins that transfer heat generated by the heating cables to environment surrounding the mounting rail. A terminal block may be mounted on the DIN rail and may supply electric power to the heating cables.

A modular rack system and method includes a rack having plural electrical interfaces, and plural module panels configured to mate with the electrical interfaces of the rack. The module panels have one or more of a common exterior size or a common exterior shape. At least two of the module panels have different internal electrical components configured to perform different operations. The rack is configured to be conductively coupled with a power delivery system of a vehicle and the module panels are configured to modify electric current prior to the electric current being supplied to the power delivery system of the vehicle.

A modular rack system and method includes a rack having plural electrical interfaces, and plural module panels configured to mate with the electrical interfaces of the rack. The module panels have one or more of a common exterior size or a common exterior shape. At least two of the module panels have different internal electrical components configured to perform different operations. The rack is configured to be conductively coupled with a power delivery system of a vehicle and the module panels are configured to modify electric current prior to the electric current being supplied to the power delivery system of the vehicle.

A network switch subrack in a cabinet system is configured to bear a network switch. The network switch subrack includes an outer frame that is configured to be plugged into the cabinet. The outer frame includes a cavity sized to accommodate the network switch. The network switch subrack further includes a fastening assembly that is disposed in the outer frame and configured to fasten the network switch in the cavity in the outer frame. The network switch subrack further includes a transfer module having a first end pluggably connected to the cabinet system and a second end pluggably connected to the network switch.