An electronic device including a substrate, a first electronic component provided on the substrate, a heat sink attached to the substrate, and a first heat conductive member located between the first electronic component and the heat sink and conducting heat of the first electronic component, in which the first heat conductive member includes a plastic heat conductor and an elastic heat conductor, and the plastic heat conductor and the elastic heat conductor are in contact with each other.

Examples described herein relate to an interface and a network interface device coupled to the interface and comprising circuitry to: control power utilization by a first set of one or more devices based on power available to a system that includes the first set of one or more devices, wherein the system is communicatively coupled to the network interface and control cooling applied to the first set of one or more devices.

The present disclosure provides a fan module and a case including the fan module. The fan module includes a fan, a fan bracket and a traction structure. The fan bracket includes: a fixed bottom plate for carrying and fixing the fan; and a connection structure, connected to the fixed bottom plate and used for being connected to a case through plugging. The traction structure is mounted on the fan bracket, and is used for pulling the fan bracket from the inside of the case to the outside of the case. In the present disclosure, the fan module is plugged into the case, and is pulled to the outside of the case from the inside of the case through a traction interface. In this way, the fan maintenance is implemented without disassembling the case or cutting off the power, the maintenance efficiency is improved, and the maintenance cost is reduced.

An efficient, high density, inline converter module includes a power conversion circuit and an input wiring harness for connecting the input of the power circuit to a unipolar source. A second wiring harness or electrical connectors may be provided for connecting the output of the power conversion circuit to a load. Connections between a wiring harness and the power conversion circuit may comprise conductive contacts, configured to distribute heat. The power circuit may be over molded to provide electrical insulation and efficient heat transfer to external ambient air. A DC transformer based inline converter module may be used in AC adapter, vehicular, and power system architectures. An input connector for connecting the input wiring harness to the input source may be provided. In some embodiments the input source may be an AC source and the input connector may comprise a rectifier for delivering a rectified, unipolar, voltage to the input of the power conversion assembly via an input wiring harness. By separating the rectifier from the power conversion assembly, the power conversion assembly may be packaged into a smaller volume than would be required if the rectifier, and its associated heat loss, were included in the power conversion assembly.

A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.

A cable drum for supplying power to an electrically powered utility vehicle, with an axially running winding body which can be set in rotation about a rotational axis in order to wind up and unwind an electrical cable, wherein on an inside, the winding body carries a plurality of fans which are configured to generate a cooling air stream directed radially outward with respect to a cylindrical drum wall.

A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.

Electrical equipment comprising a cover, a circuit board, and a heatsink arranged to dissipate heat produced by the circuit board outwards from the electrical equipment, the heatsink comprising at least one free fin and at least one fastener fin, the electrical equipment being such that, when the electrical equipment is assembled, the free fin(s) extend(s) outwards from the electrical equipment without being covered by the cover, and the cover is snap-fastened to the fastener fin(s).