Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.

Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.

A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.

A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

An electrical power conversion unit is provided with: a circuit connecting part which includes a positive electrode conductor, a negative electrode conductor, and an alternating current conductor; a power semiconductor module connected to a specific side of the circuit connecting part; a fin that extends to the opposite side of the circuit connecting part with respect to the power semiconductor module; and a capacitor disposed at one end in the lengthwise direction of the circuit connecting part. A space in which a cooling fan is disposed is formed by an extending part and the fin, when the extending part is defined as a region, of the circuit connecting part, other than the portion at which the fin projects to the circuit connecting part, such region including one end that is opposite, via the fin, the one end where the capacitor is present.

A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.

An electrical contactor assembly includes an electrical contactor having an electrical lead having a contactor pin extending therefrom, an electrical bus bar, and at least one post extending between the electrical contactor and the electrical bus bar. The post is constructed from an electrically and thermally conductive material. The post includes an opening for receiving the contactor pin and the opening includes a contactor-foil material disposed in contact with the pin.

Electronic devices are disclosed including hydrophobic or oleophobic coatings that control coolant flow therein or thereon. In at least one embodiment, a power inverter cold plate is provided including coolant inlet, a coolant outlet, a coolant flow spreading region, a coolant flow collection region, and a coolant heat-transfer region disposed therebetween; and one or more layers of a hydrophobic or oleophobic coating configured to control a flow of coolant in the cold plate. A method may include applying one or more layers of a hydrophobic or oleophobic coating to a power inverter cold plate to control a flow of coolant in the cold plate, the one or more layers being applied to one or more of a coolant flow spreading region, a coolant flow collection region, or a coolant heat-transfer region disposed therebetween. The layers may define coolant flow paths, eliminate recirculation zones, and/or prevent coolant leak paths.

A system and method for energy harvesting in a data center has one or more collection devices, a thermoelectric device, and a controller for directing the operation of the thermoelectric device and other equipment in the data center. The waste heat generated by the servers in the data center is harnessed and directed into the thermoelectric device where the waste heat is converted to usable electrical energy under the direction of the controller. The recycled electrical energy is then combined with utility-input power and provided to the servers and other equipment in the data center for consumption.

An electronic control unit (1) having a housing (2) containing a circuit board (5). The housing (2) includes a base (3) and a cover (4) between which the circuit board (5) is located, and the unit being characterised in that the base (3) and the cover (4) are connected to one another via interference fit interengagement around at least a major part of a peripheral edge (20) of the cover (4).