A photovoltaic junction box comprising a diode module and a circuit board disposed in a box body, and a heat sink mounted on the outer surface of the box body. The diode module is attached to the back side of the heat sink and is electrically connected to cooper conductor. The heat sink is made of aluminum material and a heat-absorbing layer is provided inside the heat sink. The heat-absorbing layer is close to the diode module. The aluminum heat sink provides great thermal conductivity, therefore, can greatly increase the cooling capacity of the junction box. In addition, because metal material for higher temperature resistance is used instead of lower temperature resistance plastic material, the box body would not deform as easy, greatly increase the safety and reliability of the junction box.

A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.

A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.

According to one embodiment, a rack cooling module for an electronics rack. The module includes a manifold section that has a supply manifold that is coupled to a supply manifold connector, the supply manifold is arranged to supply liquid coolant from a coolant source to supply manifold connectors, and a return manifold that is coupled to return manifold connectors, the return manifold is arranged to return liquid coolant from the return manifold connector to the coolant source. The module also includes a detection section that has a channel that extends vertically within the detection section and a leak detection sensor that is disposed within the channel, a pump that couples the channel to the return manifold, and a valve that couples the channel to the supply manifold.

The present disclosure provides a power module assembly and a converter. The power module assembly includes a power module and a capacitor module, and the power module and the capacitor module are configured to be detachably connected; the power module includes a first bus bar, and the first bus bar includes a first connection portion and a power installation portion connected to the first connection portion; the capacitor module includes a second bus bar, and the second bus bar includes a second connection portion and a capacitor installation portion connected to the second connection portion, wherein the first connection portion and the second connection portion extend along a first direction, and the power installation portion and the capacitor installation portion extend along a second direction; the first connection portion and the second connection portion are connected by a fastener.

A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

A cooling unit includes a heat exchanger coil positioned coupled to a source of fluid. The heat exchanger includes at least one coil configured to face air being drawn through the heat exchanger. The at least one coil has a first pipe, a second pipe spaced from the first pipe, and a plurality of micro-channels disposed between and in fluid communication with the first pipe and the second pipe. Each of the first pipe, the second pipe and the plurality of micro-channels is configured to enable a countercurrent configuration between inner and outer fluids. Other embodiments of the cooling unit and methods of cooling are further disclosed.

A system and method for active disturbance rejection based thermal control is configured to receive, at a first active disturbance rejection thermal control (ADRC) controller, a first temperature measurement from a first thermal zone. The ADRC controller generates a first output control signal for controlling a first cooling element, wherein the first output control signal is generated according a first estimated temperature and a first estimated disturbance calculated by a first extended state observer (ESO) of the first ADRC controller.

A cooling device includes a thermally conductive housing member that houses a heat generating body, a first air blower that generates first cooling wind flowing along the housing member through the heat generating body inside the housing member, and a second air blower that generates second cooling wind flowing along the housing member outside the housing member.