A disclosed example includes: a resource utilization analyzer to determine 1) first workloads of a first workload type deployed in a first server room in a data center, and 2) second workloads of a second workload type deployed in the first server room; a workload authorizer to determine that first virtual machines executing the first workloads and second virtual machines executing the second workloads cause a first server rack to generate an amount of heat; and a migrator to migrate the first virtual machines from the first server rack of the first server room to a second server rack of a second server room in the data center to reduce a temperature in the first server room based on the amount of heat, the migrator to migrate the first virtual machines to the second server rack without migrating the second virtual machines to the second server rack.

A fastening device is introduced. The fastening device includes a seat body, a first fastening body and a second fastening body. The seat body may be disposed on a first object; the first fastening body is movably provided in the seat body, the first fastening body cooperates with the seat body for fastening and unfastening, so that the first fastening body couples with or separates from a second object; the second fastening body is movably provided in the first fastening body, the second fastening body cooperates with the first fastening body for fastening and unfastening, so that the second fastening body couples with or separates from a third object.

An electric connection box that has a function of relaying power of power supply supplied from an input-side power supply line and supplying the relayed power of power supply to an output-side load on a vehicle, that includes a first circuit unit, a second circuit unit, and an air blower configured to blow air to the first circuit unit, and in which the first circuit unit and the second circuit unit are arranged in a state of being close to each other, the electric connection box includes: a gap portion that is a space formed on a boundary between the first circuit unit and the second circuit unit; and an airflow guide portion configured to guide an airflow blown by the air blower to both the first circuit unit and the gap portion.

A first cooling apparatus includes a first heat sink having multiple first fins having a U-shaped opening and an O-shaped opening which are provide therein, a first heat receiving member configured to be brought into abutment with a heat source, and a first heat pipe which extends from one end which is connected with the heat receiving member towards the other end, and the first heat pipe has a first extending portion which extends from the one end, a bent portion which is bent from the first extending portion and at least a part of which is disposed inside the U-shaped opening, and a second extending portion which extends from the bent portion and at least a part of which is disposed inside the O-shaped opening.

According to various embodiments of the disclosure, an electronic device may includes: a first housing in which a display module is disposed; a second housing in which a circuit board and a cooling fan connected to the circuit board are accommodated, where a first opening is defined in the second housing to introduce air into the cooling fan; and a hinge module rotatably connected to the first housing and the second housing, and disposed adjacent to the first opening. The hinge module may includes: a hinge housing in which a first hinge opening is defined to be connected to the first opening; a first main gear disposed in the hinge housing and operably connected to the first housing; a second main gear operably connected to the second housing and configured to rotate in correspondence with the first main gear; a driving gear disposed adjacent to at least one of the first main gear or the second main gear and rotatable in correspondence with at least one of the first main gear or the second main gear; and a first cover plate disposed in the hinge housing and including a first rack gear area which meshes with the driving gear. The electronic device may be switchable between a closed state in which an angle formed by the first housing and the second housing is less than a predetermined angle and an open state in which the angle formed by the first housing and the second housing is equal to or greater than the predetermined angle. When the electronic device is in the closed state, the first cover plate is disposed to overlap with at least part of the first hinge opening. When the electronic device is in the open state, the first cover plate may be spaced apart from the first hinge opening, and the first hinge opening may be opened.

In one or more embodiments, a fan circuit may be configured with an input of a first amplifier coupled to a revolution indicator associated with a fan; an output of the first amplifier coupled to an input of a second amplifier; and a power supply input of the second amplifier coupled to a first contact of a first connector. In one or more embodiments, the first contact of the first connector may be coupled to a first contact of a second connector to drive a resistive load coupled to the first contact of the second connector; a second contact of the first connector may be coupled to a second contact of the second connector to provide a reference voltage to the second amplifier; and the second amplifier may provide amplified signals to the first contact of the first connector based at least on signals received from the revolution indicator.

Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material.

A fan receiver assembly (1200) includes a fan receiver (101). The fan receiver includes a rear wall (128) and at least one sidewall (112). At least one deformable clasp (105) is coupled to, and translatable along, the sidewall. The deformable clasp includes at least one latching arm (142) that is pivotable between an axially displaced open position occurring when the latching arm extends beyond a terminal end sidewall and a parallel position occurring when the latching arm is situated between the terminal end and the rear wall. The sidewall defines a d-track (111) having a terminal end (125) and an outward notch (126). A follower situates within the d-track between the deformable clasp and the sidewall. A fan module (102) latches to the fan receiver assembly when the follower situates within the outward notch.

The integrated dual-motor controller includes a controller housing, a bus magnetic ring component, an all-in-one module, a control plate, an isolation plate and a drive plate. The bus magnetic ring component, the all-in-one module, the control plate, the isolation plate and the drive plate are all integrated in the controller housing. The integrated dual-motor controller is designed to achieve a high level of integration, and a modular design is used inside to facilitate mounting and reduce the size.

In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.