A power converter apparatus includes a power module assembly including a power module and a cooler overlapping with the power module to allow the cooler to cover both sides of the power module, and a capacitor and a low voltage direct-current (DC)-DC converter (LDC) which are coupled in a state of pressing the power module assembly on both sides of the power module assembly.

A system for cooling of computing components of an information handling system, including a printed circuit board (PCB); a computing card connector coupled to the PCB, the computing card connector including first mating features; a computing card coupled to the computing card connector; and a thermal plate including a first end and a second end positioned opposite to the first end, the second end including second mating features that correspond to the first mating features of the computing card connector, wherein the thermal plate is coupled to the computing card connector at the second end of the thermal plate such that the second mating features of the thermal plate are mated with the first mating features of the computing card connector.

One example implementation provides a method for controlling enclosure interior temperature, including obtaining, from a thermostat, temperature data indicative of interior enclosure temperature; determining, using a controller, that the temperature data indicates that the interior enclosure temperature exceeds a set point; simulating for a heat exchanger, using the controller, loss of alternating current (AC) power supply; and thereafter operating, using the controller, the heat exchanger and an air conditioner above the set point.

The disclosed computing device may include electronic components, at least one of which is a processor. The computing device may also include a heat sink thermally coupled to the electronic components, as well as a temperature sensor that determines the current temperature inside the computing device. The computing device may further include a controller. The processor may generate a load schedule for the electronic components based on the current temperature inside the computing device. This load schedule ensures that a maximum temperature for the heat sink is not exceeded even when the total system power load exceeds, for a short period of time, the maximum sustainable power level the heat sink can dissipate. The controller may then load the electronic components according to the generated load schedule. Various other methods, systems, and computer-readable media are also disclosed.

A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.

A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Access points can be mounted in a variety of locations or orientations and can support multiple communications protocols. In some embodiments, an access point includes a main housing and a front housing. The main and front housing are connected by a hinge. A Wi-Fi antenna is included in the front housing in some embodiments. The access point is configured for use in either an open or closed position. When mounted in a vertical position, the front housing can be lowered into a horizontal position, which facilitates a preferred orientation of an antenna with respect to the ground. A first set of cooling fins serves to maintain components of the access point offset from a wall to which the access point is mounted. This facilitates airflow. Additional fins act as a spacer between the main housing and the front housing when the access point is used in a closed position. This facilitates air flow around both sides of the main housing.

The cooling system may comprise: an electric machine; a first conduit including a cable housing and an inlet; a plurality of conductive cables extending from the electric machine, the plurality of conductive cables disposed at least partially in the cable housing; and an electric fan disposed in the first conduit, the cooling system configured to passively flow air through the first conduit to cool the plurality of conductive cables during operation of the gas turbine engine, and the electric fan configured to actively cool the plurality of conductive cables after an engine shutdown of the gas turbine engine.

Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

A cooling apparatus includes a cold plate with a first refrigerant channel through which refrigerant flows, and a pump to circulate the refrigerant. The cold plate includes a bottom wall and an upper wall. A lower surface of the bottom wall is in contact with a heating element. The upper wall is located in contact with the bottom wall. A lower surface of the upper wall and an upper surface of the pump directly oppose each other. A lower surface of the pump is exposed to an outside of the cooling apparatus.