A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

Provided is anisotropic graphite for producing an anisotropic graphite composite having excellent thermal conduction property and excellent long-term reliability as a heat dissipating member. Given an X axis, a Y axis orthogonal to the X axis, and a Z axis perpendicular to a plane defined by the X axis and the Y axis, and a crystal orientation plane of the anisotropic graphite is parallel to an X-Z plane, and a specific number of holes each having a specific size are formed in at least one surface out of surfaces of the anisotropic graphite which are parallel to an X-Y plane.

There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.

An information handling system includes a corrosion controller that may monitor a corrosion sensor array, and determine a type of the corrosion based on a location of a corrosion sensor. The corrosion type may include humidity driven corrosion and non-humidity driven corrosion.

In an electric power steering device, a motor housing includes an end face part opposite to an output part of a rotating shaft of an electric motor. A power conversion circuit part includes a power conversion switching circuit part, and a second part exclusive of the power conversion switching circuit part. The power conversion switching circuit part includes an upper arm switching element and a lower arm switching element packaged by synthetic resin, and is mounted on a power conversion switching circuit board that is mounted to a power conversion switching circuit part heat dissipation section of the end face part for heat dissipation. A power supply circuit part and the second part of the power conversion circuit part are mounted on a power supply circuit board that is mounted to a power supply circuit part heat dissipation section of the end face part for heat dissipation.

One aspect is directed to a system for controlling airflow in a facility having a ceiling-ducted aisle airflow containment system having a first damper system for controlling airflow. The system includes an input to receive parameters related to airflow in the facility, wherein the parameters include at least one airflow resistance value for a device in the facility, an output to provide output data including at least one setting for one or more controllable devices in the facility, and one or more processors configured to receive the parameters related to airflow, determine airflow values associated with the airflow containment system and based on the airflow values, generate the at least one setting for the one or more controllable devices, including at least one setting for the first damper system.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

An electrical device includes a housing part and a cover part, the cover part being connected to the housing part, in particular with the aid of screws, the cover part in particular covering an opening of the housing part. A first circuit board is connected to the cover part, and an elastically preloaded sheet-metal part, in particular an elastically preloaded tab section of a sheet-metal part, presses at least one heat-generating component, in particular a controllable semiconductor switch, in the direction of the cover part, in particular for the purpose of dissipating heat from the heat-generating component into the environment via the cover part.

The camera module with improved heat dissipation function include a base, a photosensitive chip, a circuit board; and a heat conducting sheet. Wherein the base comprises a first surface and a second surface opposite to the first surface. A portion of the first surface is recessed to form a third surface between the first surface and the second surface, and to form a plurality of sidewalls connecting the first surface and the third surface, the third surface and the plurality of sidewalls cooperatively define a slot. Wherein the photosensitive chip is fixed on the third surface and accommodated in the slot; the circuit board is fixed on the first surface. A gap is defined between the circuit board and the photosensitive chip; the heat conducting sheet is disposed in the gap.