Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a substrate support assembly disposed within the chamber body. The chambers may include a substrate support assembly having a support plate seated atop a support stem. The chambers may include a radio frequency (RF) shield seated atop the chamber body and extending about a peripheral edge of the support plate. The RF shield may include a lower annular member. The RF shield may include an upper annular member seated atop the lower annular member. The upper annular member may define a lip that protrudes radially outward from an outer surface of the upper annular member. Each of the lower annular member and the upper annular member may include a dielectric material.

A device for multi-energy field induced atomic-scale CNC machining in an environmental atmosphere comprises an electromagnetic shielding chamber and a control mechanism, wherein an environmental chamber is arranged in the electromagnetic shielding chamber, a workpiece platform is arranged at the bottom of the environmental chamber, and a nanotool driven by a nanotool actuator is arranged at the top of the environmental chamber, and a gas inlet and a gas outlet which are connected to the environmental chamber are formed in the electromagnetic shielding chamber; and the control mechanism is used for controlling the workpiece platform and the nanotool actuator and applying energy fields including a force field, a temperature field, an electric field, an optical field and a magnetic field. The device has the advantages of atomic precision, high efficiency, low cost and good universality.

A subsea substation system including: an oil-filled water impermeable enclosure; an AC-transformer, and at least one overcurrent device electrically connected to the AC-transformer, the at least one overcurrent device, the AC-transformer, and the electrical connections between them are accommodated in the oil-filled water impermeable enclosure, wherein the enclosure includes thermal zones within the enclosure, wherein the AC-transformer is arranged in a first thermal zone and the overcurrent devices are arranged in a second thermal zone of the enclosure, a thermal layer separate the first thermal zone and the second thermal zone, the at least one thermal layer is configured to allow oil flow between the thermal zones while reducing heat flow between the zones.

A portable shelter with electromagnetic interference (EMI) protection includes a plurality of walls that define an interior space. The walls can be fixed or movable. An EMI protected edge connector joins at least two of the walls together. The EMI protected edge connector assembly can be fixed or hinged. The edge connector can include a metallic outer edge member with two legs and a separate metallic inner edge member with two legs to define an edge channel therebetween with: (i) the first outer leg and the first inner leg are arranged parallel and spaced-apart relative to each other; and (ii) the second outer leg and the second inner leg arranged parallel and spaced-apart relative to each other. The shelter walls can include an inner surface covered by a metallic foil inner layer. A first wall panel is received in a first portion of the edge channel with its metallic foil inner layer contacting the inner edge member and a second wall panel is received in a second portion of the edge channel with it metallic foil inner layer contacting the inner edge member.

An electromagnetic wave reflector includes a panel having a reflective surface that reflects a radio wave of a frequency band selected from 1 GHz to 170 GHz, and a support body that supports the panel, The support body has a connector part electrically connected to the reflective surface, the connector part being configured to propagate a reference potential of a reflection having occurred at the reflective surface.

A door assembly provides EMC shielding to provide EMI/RFI protection. The door assembly has an EMC door frame, an EMC door, and EMC seals for maintaining a circuit between the door frame, the floor (e.g., threshold, flooring, etc.), and/or the door. The door assembly may also utilize one or more EMC elements (e.g., EMC tape, paint, adhesive, coatings, caulk, etc.) that may be used to create the circuits between the components of the door assembly and/or with other components of the building (e.g., between the door frame and the wall). The EMC shielding is used to reduce (e.g., limit, block, etc.) the levels of electrogenic interference (EMI)/radio frequency interference (RFI) radiation that is able to pass by the shielding. Moreover, the door assembly also provides improve additional door assembly performance (e.g., sound, weather, air flow, heat, cold, or the like abatement, energy harvesting, or other performance benefits).

A device for multi-energy field induced atomic-scale CNC machining in an environmental atmosphere comprises an electromagnetic shielding chamber and a control mechanism, wherein an environmental chamber is arranged in the electromagnetic shielding chamber, a workpiece platform is arranged at the bottom of the environmental chamber, and a nanotool driven by a nanotool actuator is arranged at the top of the environmental chamber, and a gas inlet and a gas outlet which are connected to the environmental chamber are formed in the electromagnetic shielding chamber; and the control mechanism is used for controlling the workpiece platform and the nanotool actuator and applying energy fields including a force field, a temperature field, an electric field, an optical field and a magnetic field. The device has the advantages of atomic precision, high efficiency, low cost and good universality.

An EMI shielding and acoustic attenuation door frame and door system, including: a door connected to a door frame with a hinge, the door including a bottom portion having a plate, a door gasket, a door sponge, and conductive tape for grounding the door; the door frame including: a jamb section including: a jamb main frame; a jamb back frame; wherein the jamb main frame and back frame being adjustable along the wall; a layered jamb gasket at least partially in between the door frame and the jamb main frame; a flanged magnetic jamb gasket fixed to an acoustical retainer with a fastener; wherein the door is grounded when the door is in a closed position against the door frame; a sill section including: a spreader bar having at least one sill gasket covered by a threshold, the spreader bar and at least one sill gasket contacting a floor shielding.

Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a substrate support assembly disposed within the chamber body. The chambers may include a substrate support assembly having a support plate seated atop a support stem. The chambers may include a radio frequency (RF) shield seated atop the chamber body and extending about a peripheral edge of the support plate. The RF shield may include a lower annular member. The RF shield may include an upper annular member seated atop the lower annular member. The upper annular member may define a lip that protrudes radially outward from an outer surface of the upper annular member. Each of the lower annular member and the upper annular member may include a dielectric material.

A pair of fabric EMI gaskets run in parallel and adhered onto a perimeter of a conductive ferrous hardroom door surface. A row of magnets running in between the pair of fabric EMI gaskets is magnetically adhered onto the perimeter of the door surface. A series of conductive non-ferrous spring clips are inserted between the pair of fabric EMI gaskets in at least corners of conductive ferrous hardroom door surface. A strip of felted wool is deployed above the non-ferrous spring clips and the row of magnets. A cam lever rotatably attached between the hardroom door pries open and breaks magnetic forces between the row of magnets and a conductive ferrous surface of a door frame.