An embodiment of a camera module may comprise: a lens part; a front body receiving the lens part; a rear body coupled to the front body; a substrate part received inside the rear body and comprising a plurality of printed circuit boards; a cable electrically connected to the substrate part; a connector part connecting the cable with the substrate part; and a first shielding part, made of a conductive material and disposed at a rear side of the connector part, for shielding electromagnetic noise generated from the substrate part or the outside.

Provided herein is an inverter module to power an electric vehicle. The inverter module can include a power module or multiple power modules. The power module can include a capacitor and a heat sink coupled with the capacitor. The power module can include a ceramic plate coupled with the heat sink. The power module can include a locator having a plurality of slots and a plurality of transistors disposed within the plurality of slots. The locator and the plurality of transistors can be disposed over a first surface of the ceramic plate. The power module can include a laminated bus bar disposed over a first surface of the locator. The power module can include a gate drive printed circuit board coupled with the laminated bus bar. The power module can include a dielectric gel tray disposed over a first surface of the gate drive printed circuit board.

The present invention relates to the use of additive manufacturing as applied to radiation shielding. In particular, additive manufacturing formulations are described which provide shielding for neutron and photon radiation and which can extend the useful operation life of remote sensing devices utilized to conduct surveillance and inspection work where such radiation fields are present.

Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

A power converting apparatus according to the present disclosure includes: a capacitor being supplied with a DC from a battery of a vehicle; at least one or more power converting modules including a power terminal through which a current is input and output and a signal terminal through which signals are input and output, and disposed perpendicular to the capacitor with the power terminal facing the bottom of the capacitor and the signal terminal facing the top of the capacitor; a control unit disposed over the capacitor and controlling the power converting module; and a housing assembled with the capacitor, the power converting module, and the control unit.

A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.

An apparatus configured to measure electromagnetic radiation coupled from an image sensor integrated circuit (IC) to a nearby cell phone antenna has an image sensor PCB with the image sensor IC on a first side and image sensor decoupling capacitors disposed on a second side, the image sensor PCB disposed within a shielding box. The apparatus also has an image processor PCB with an image processor IC on a first side and at least one image processor decoupling capacitors, the image processor IC electrically coupled to the image sensor IC. The image processor IC is located outside the shielding box, and the at least one image processor decoupling capacitor is within the shielding box. In embodiments, the decoupling capacitors are shielded with separate, additional, metal covers.

In accordance with some embodiments, an apparatus that seals the audio path of an enclosed device is provided. The apparatus includes a first housing portion and a second housing portion, when mated, are arranged to enclose a device, where a surface of the second housing portion is arranged to impart pressure on the device toward the first housing portion. The apparatus further includes a first supporting portion disposed along one side of the first housing portion and arranged to support the device. The apparatus also includes a first liner disposed in the first housing portion and arranged to form a first cavity, where the first cavity is adjacent to the first supporting portion. The apparatus further includes a noise generator operable to provide noise signal stream and a first audio output device coupled to the noise generator operable to output first masking signals to the first cavity.

A power converting apparatus according to the present disclosure includes: a capacitor being supplied with a DC from a battery of a vehicle; at least one or more power converting modules including a power terminal through which a current is input and output and a signal terminal through which signals are input and output, and disposed perpendicular to the capacitor with the power terminal facing the bottom of the capacitor and the signal terminal facing the top of the capacitor; a control unit disposed over the capacitor and controlling the power converting module; and a housing assembled with the capacitor, the power converting module, and the control unit.

An atomic oscillator includes an atom cell that accommodates an alkali metal atom therein, a container that houses the atom cell, a substrate on which the container is disposed, and a thermally insulating mount that is fixed to the substrate and positions the container relative to the substrate.