As a noise-reducing shielded cable according to the present invention, provided is a shielded cable having an inverter (10), a motor (30), a cable (20) connecting the inverter and the motor with each other, a shield layer (40) covering the cable, and two ground wires (50) grounding both ends of the shield layer.

Disclosed is a shielding structure for an integrated inductor/transformer, configured under the integrated inductor or the transformer and upon a substrate. The shielding structure comprises conductive units, first connecting portions, via holes, a second connecting portion and a grounding portion. Each conductive unit comprises a first conductive portion and second conductive portions extending from the first conductive portion. The number of the second conductive portions is odd. The length of each second conductive portion progressively diminishes from a center of the first conductive portion to both of two ends of the first conductive portion. The first connecting portion connects the first conductive portions of the conductive units through via holes. The grounding portion is connected to one of the first conductive portions. The second connecting portion connects all longest second conductive portions together. Moreover, the conductive units and the second connecting portion are made of different conductive materials.

The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material.

The present invention is a method and system for storing charge on a body and subsequently electrically grounding that body so the body can operate without the unwanted effects of an electrical charge. The system of the present invention comprises an electrical conducting medium, which may be a human body, a capacitance article, and a grounding apparatus. In use the capacitance article is connected to the electrical conducting medium to reduce the buildup of electrical charge on the electrical conducting medium and instead store the charge in the capacitor of the capacitance article. The electrical conducting medium may then be connected to the grounding apparatus at a predetermined interval remove any built-up charge on both the capacitance article and the electrical conducting medium by putting those components in electrical continuity with the ground.

The present disclosure relates to an inverter mounting structure having improved ease of assembly and durability, and capable of simplifying the structure of an inverter. According to one aspect of the present invention, provided is an inverter mounting structure comprising: a bracket fixed to an enclosure or a wall surface and forming an inverter accommodation space in which the inverter is accommodated and coupled; and an option case coupled to the outside of the bracket.

A component grounding system according to one embodiment includes a case for accommodating a plurality of components, a direct current (DC) capacitor disposed on one side of the case and electrically connected to the case, and a bus bar, disposed between the case and the DC capacitor, for connecting the case and the DC capacitor, the bus bar representing an electrode, wherein each of the plurality of components may be connected to the bus bar.

The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.

The present disclosure relates to an integrated controller for a cooling module, the integrated controller including: a case having a connector: a plurality of terminals coupled to the case and having one end protruding into the case and the other end protruding into the connector; a control board accommodated in the case and coupled and electrically connected to the one end of the plurality of terminals; and a shielding plate shielding electromagnetic waves by surrounding the plurality of terminals and coupled to the case, in which the plurality of terminals generating electromagnetic waves is surrounded by the shielding plate to be able to absorb the electromagnetic waves can be absorbed such that the integrated controller can protect surrounding electronic devices and systems.

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and/or printed coating. The EMI shield may include a darkened coating.

A two-part external metal shield for electromagnetic interference reduction that reduces vulnerability of a shielded sensor is provided. An example electromagnetic shield for a sensor includes: a first portion defining a first part of an interfacing profile and one or more tabs; a second portion defining a second part of an interfacing profile; where the first portion and the second portion combine to form a cavity into which the sensor is received, where the one or more tabs extends into the cavity along a first axis, and where the first part of the interfacing profile is secured to the second part of the interfacing profile along a second axis perpendicular to the first axis.